Industry Directory | Other / Manufacturer
SMT & THT assembly of PCB, production of assembling and soldering equipments for small volume production - v�cuum manipulators, reflow ovens and replacements of wave soldering.
Industry Directory | Distributor
We would like to help your company with electrical and electronic production materials and increase our working volume in your region. Solder-Flux Soldering-Rework Station Chemical Hand Tool Fault Detection Inspection ESD Label
The World's Best Convection Reflow Oven The ultimate high volume production reflow oven with belt speeds up to 1.4 m/min to accommodate the fastest pick and place systems. Lead Free Certified reflow oven! Maintenance Free! Lowest Nitrogen &
The World's Best SMT Convection Reflow Ovens for Large Boards and Dual Lane 1826 Mark 5 reflow oven provides consistent performance for high volume reflow requirements while minimizing preventative maintenance and floorspace. Lead Free Certified!
Used SMT Equipment | SPI / Solder Paste Inspection
CyberOptics SE500 3D SPI Vintage: 2013 3D Height, Volume, and Area Measurements Max PCB Size: 20" x 20" Min PCB Size: 2" x 2" Complete & Operational
Used SMT Equipment | SPI / Solder Paste Inspection
Vintage: 2008 Description: 3D Solder Paste Inspection Details: • 3D sensing system w/ built-in fiducial camera and lighting • MicroPad Sensor • Mechanical board stop • Auto-width adjust conveyor • Max PCB width: 20” x 20” • Max inspection
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2017-09-16 02:29:39.0
Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes. The pump is controlled with a servo motor equ
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Sun Apr 11 18:30:00 UTC 2021 - Sun Apr 11 18:30:00 UTC 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Sun Aug 09 18:30:00 UTC 2020 - Sun Aug 09 18:30:00 UTC 2020 | ,
Monitoring & Bench marking Your Processes and Assembly Yields
Career Center | Shelbyville, Tennessee USA | Engineering
Provide Engineering support for automotive manufacturing facility. Responsible for leadership on leading edge technologies with all soldering and associated assembly processes, ranging from new product process design to successful ramp up of volume
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | Rochester, New York USA | Engineering
I have done my undergraduate studies in Mechanical Engineering. I am pursuing my Master's Program in Electronics Packaging. I am currently working as a Research Assistant for RIT-CEMA (Center for Electronics Manufacturing and Assembly). My research
Career Center | Mt. Pleasant, Pennsylvania USA | Management,Production,Quality Control
I am currently employed at STCP (SONY Technology Center Pittsburgh) as a Surface Mount Operator. I have three years experience working with Panasonic placement equipment as well as discrete and high speed machines also. I am fully trained and experie
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
SMT Express, Volume 2, Issue No. 6 - from SMTnet.com Volume 2, Issue No. 6 Wednesday, June 14, 2000 Featured Article Return to Front Page Process Control for Solder Flux Stacy KaliszMark OwenMVTechnology Ltd. ABSTRACT Flux used in ball
Heller Industries Inc. | https://hellerindustries.com/1913mk7-2/
High Volume Reflow Oven -1913 Home » 1913MK7 1913 MK7 Reflow Oven The 1913 MK7 is a high volume reflow oven with 13 heated zones and belt speeds up to 1.88m/min
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/072419-lubrication-systems-standard-vs-low-volume-low-pressure
Lubrication Systems: Standard vs. Low Volume Low Pressure Nordson EFD Corporate | Global Directory | Languages Division Only All of Nordson Home Products Accessories
