Industry Directory | Manufacturer
Thermally Managed ( up to 1000 W /m K thermal transfer rate ), CTE controlled, Very Rigid, Light Weight STABLCOR PCB / Substrate Technology
Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
New Equipment | Assembly Services
Product features: The servo system is convenient and accurate for positioning. The Japanese THK guide rail and Taiwan STK variable frequency motor are used to drive the scraper base to ensure the printing accuracy. The printing scraper can be rota
Electronics Forum | Wed Sep 26 10:11:08 EDT 2007 | morris
Bearwear Inc. Makes the wave solder weight bags you are searching for. Lewisville Texas 972-315-6457 http://www.webspawner.com/users/bearwear/
Electronics Forum | Mon Jul 14 09:41:35 EDT 2008 | davef
Q1. Do we really need to follow the IPC J-STD-001 Solder purity? A1. Yes, you should control impurities in solder. Further information: * "Allowable concentration of contaminating elements in solder: impurities are harmless unless their level goes to
Used SMT Equipment | Soldering - Wave
2005 Speedline Technologies Vectra 450F Wave Solder Note: The solder pot is full of lead-free solder. The weight of this solder is estimated at 1600 lbs. Item Location: Westerville, OH USA Serial: 498509 Features: Ultra Fill Lead-Free OptiFlux II Int
Used SMT Equipment | SPI / Solder Paste Inspection
Product Name: Table Top 3D SPI Model Name: KY3020T Serial Number: SPI-2T 210 Voltage: 220Va.c, 1Phase, 50/60HZ Rated Current: 0.8 Amp Current Max.: 4 Amp SCCR: 10KA/220Va.c Capacity: 0.88 kW Weight: 95 Kg Machine Size (mm): 780 x 1100 x 734 IP Grade:
Industry News | 2003-05-23 08:24:49.0
Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.
Industry News | 2020-10-12 15:09:12.0
Enables easier set-up and ensures accurate mix ratios by volume or weight to improve overall dispense quality ASYMTEK, a part of Nordson ELECTRONICS SOLUTIONS - a global leader in electronics manufacturing technologies, announces its latest technology has received the Global Technology Award 2020 for fluid dispensing equipment. Nordson Electronics Solutions developed the patent-pending software, Automated Ratio Calibration Technology (ARC™ Technology), to enable easier set-up and sustained mix ratios for dispensing two-component (2K) fluid materials. ARC Technology is part of a system, which includes ASYMTEK Vortik® progressive cavity pumps and ASYMTEK dispensing platforms, that ensures consistently accurate mix ratios by volume or weight to improve overall dispense quality. The award was announced by Global SMT & Packaging magazine during a virtual ceremony held on September 29, 2020.
Parts & Supplies | Solder Paste Mixers
Solder Cream Mixer Feature of Solder Cream Mixer Excellent for ISO 9000 solder paste mix process condition. Strong mixing power. Increasing printing quality. Cream Solder Mixer Led display panel and microprocessor control, easy to operate. Unive
Parts & Supplies | Solder Paste Mixers
Solder Cream Mixer Feature of Solder Cream Mixer Excellent for ISO 9000 solder paste mix process condition. Strong mixing power. Increasing printing quality. Cream Solder Mixer Led display panel and microprocessor control, easy to operate. Unive
Technical Library | 2014-06-19 18:13:23.0
For high-density electronic packaging,the application of flip-chip solder joints has been well received in the microelectronics industry. High-lead(Pb) solders such as Sn5Pb95 are presently granted immunity from the RoHS requirements for their use in high-end flip-chip devices, especially in military applications. In flip-chip technology for consumer electronic products, organic substrates have replaced ceramic substrates due to the demand for less weight and low cost. However, the liquidus temperatures of high-Pb solders are over 300°C which would damage organic substrates during reflow because of the low glass transition temperature. To overcome this difficulty, the composite solder approach was developed...
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
SMT solder dross recovery system solder waste recycling separator online automatic solder dross separator HR-SD100 is an endeavor in reverting and recycling the oxides which occur during working of a Wave Soldering Machine in order to reduce product
1.Characteristic: 1.Highly effective recycling of the solder waste, up to 93% yield . 2.No need to add any chemicals or reducers to the process uses physical separation to ensure a good quality product. 3.Button controls, digital temperature contr
Career Center | Manhattan, Kansas USA | Production
Ultra Electronics, ICE is a leader in small aircraft aerospace systems and components. ICE secured its first contract in the aircraft industry in 1975 by designing and manufacturing a state-of-the-art deicer timer for Cessna Aircraft Company. ICE c
Career Center | Manhattan, Kansas USA | Production
Ultra Electronics, ICE is a leader in small aircraft aerospace systems and components. ICE secured its first contract in the aircraft industry in 1975 by designing and manufacturing a state-of-the-art deicer timer for Cessna Aircraft Company. ICE c
Career Center | , | Engineering,Sales/Marketing,Technical Support
Applications Engineer with over 20 years of combined Manufacturing/Field Service/Applications Engineering experience in the SMT industry.
Career Center | Reno, Nevada USA | Engineering,Maintenance,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
Extensive technical background including tenures providing robotics technology expertise to diverse national and international clients and supporting surface mount technologies for printed circuit board (PCB) manufacturing processes. Results-oriente
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/adhesive-dispensing-systems-products/bc-coating--laminating-applicators
Valve Systems Optimum Dispense Tips Optimum Syringe Barrels and Cartridges Solder Paste and TIM Two-Component Dispensing Volumetric Dispensing Nordson ELECTRONICS SOLUTIONS Back Nordson ELECTRONICS
GPD Global | https://www.gpd-global.com/co_website/peelforcetester-pbftkits.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
