Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
Industry Directory | Distributor / Manufacturer
For over 60 years, Kapp Alloy & Wire, Inc has been a premier manufacturer of Babbitt, solder, and metallizing spray wire. Our goal is perfection in solder and service.
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
New Equipment | Rework & Repair Equipment
Orange Sticks with double beveled ends, 7" x 5/32" (SH-83) The Beau Tech orange sticks are made of high quality non-resin wood which will not contaminate solder and component leads. Natural wood is among the best material that does not gen
Electronics Forum | Tue Oct 02 12:56:41 EDT 2001 | Scott B
We have come across this where the operator was using thin gauge solder wire (more suited to fine pitch SMT soldering) to form large solder fillets (power connections or sheild cans). We found that the operator was feeding large amounts of solder wir
Electronics Forum | Mon Oct 01 16:55:27 EDT 2001 | davef
I agree. Poor soldering technique is the most straightward way of creating solder balls during hand soldering operations.
Used SMT Equipment | Soldering - Selective
• Dual Pot Lead/Leadfree • Drop Jet Fluxed • Inerted Nitrogen System • One AP Solder tips • PillarCOMM Windows Software • Solder Wire Feeder • Solder Bath Level Sensor • Solder Wave Height Measurement • Black and White Camera Programming • S
Used SMT Equipment | Soldering - Selective
• Process Three Boards At Once “Fluxer, Preheat, Solder Pot” • Jet Fluxer • Bottom Side Preheat, 1 Zone • Dual Pot Lead/Leadfree • Inline • Nitrogen • SMEMA Ready • Wire Solder • 4 X 400V Condition: Complete & Operational “still online” Lo
Industry News | 2003-05-12 09:19:51.0
No larger than conventional 12A wire-to-board connectors for PCB applications
Industry News | 2003-05-02 08:01:53.0
Flexstrip cable jumpers provide multiconductor board-to-board connection without wire stripping, cutting to length or solder preparation.
Parts & Supplies | Pick and Place/Feeders
03029073-02 Modul Head Interface mirrored complete X 03029113-01 machine facing cover sheet 03029123S03 CPU-PCB. SMP16-CPU086 1,6GHz 768MB 03029170-01 Lifting Table Single Conveyor, GS 03029171-02 Lifting Table Dual Conveyor, GS 03029178-01 guid
Parts & Supplies | Pick and Place/Feeders
KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
High speed, in-line, multi-platform selective soldering system Incorporating high-speed PCB transfer, the Orissa Fusion platform offers the ultimate in flexibility, coupled with reduced line length at a lower cost compared to current market offering
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,
Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
Events Calendar | Mon Jan 14 00:00:00 EST 2019 - Mon Jan 14 00:00:00 EST 2019 | ,
Webinar: Crimp Inspection, Quality Control in the Real World of Manufacture
Career Center | Tempe, Arizona | Production
Come work for stable organization that truly values their employees? Electronics manufacturing company in the Tempe area that has immediate direct hire positions available for qualified applicants. They offer a competitive salary, room for advanc
Career Center | Norcross, Georgia USA | Production
Solder Technician Reports to: Supervisor Responsibilities: 1) Melts and applies solder along adjoining edges of workpieces to solder joints, using soldering iron, gas torch, or electric-ultrasonic equipment. 2) Grinds, cuts, buffs, or bends edge
Career Center | , India | Production
Reads instructions, such as work orders, drawing, and wire lists to determine materials needed and sequence of assembly, Manual Hand tool using for Wire cutting, stripping, crimping. Soldering, Splicing, Assembling PCB Boards, Boot Shrinking, Heat
Career Center | north augusta, South Carolina USA | Production,Quality Control
Detail oriented!
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Magnet Wire and Getting a Great Solder Connection | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
