New Equipment | Board Handling - Pallets,Carriers,Fixtures
PCB Wave Solder Pallet with Top Hat Prior Plastic is one of the most professional manufacturer of wave solder pallets and reflow solder pallets in China. Each one of our pallet is custom designed to meet our client's requirements. Just tell us your
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Free Design Solder Pallet with Cover Pallet Prior Plastic is one of the most professional manufacturer of wave solder pallets and reflow solder pallets in China. Each one of our pallet is custom designed to meet our client's requirements. Just t
Electronics Forum | Mon Nov 14 14:59:32 EST 2005 | davef
Additional questions are: * Does the problem appear with pasted/soldered only boards, in addition to those with components? * What is the size of the unsoldered area? What is the size of the pad? * Where is the solder mask, relative to the pad? * Wha
Electronics Forum | Thu Jun 26 09:42:16 EDT 2008 | gabriella
Hello Mark, I would recommend to look again on the pads. in many cases board design is causing these issues. Check 1. Is pad size good for the part 2. Are both pads the same size 3. traces connected to the pads should be same size 4. vias connecte
Industry News | 2023-08-29 07:14:08.0
Pro-Active Engineering, a well-known leader in the PCB industry for over 26 years who guide customers through the complexities of design engineering, has chosen Pillarhouse International as their selective soldering process equipment provider and purchased an Orissa Fusion as part of their efforts to increase U.S. market share.
Industry News | 2024-04-29 03:28:04.0
In the dynamic world of Surface Mount Technology (SMT), precision and efficiency are paramount. Manufacturers worldwide seek inspection solutions that enhance accuracy and streamline production processes. Enter SMT AOI AI Inspection Technology – an innovative solution that combines cutting-edge artificial intelligence algorithms with advanced inspection capabilities.
Parts & Supplies | Assembly Accessories
Detailed Product Description Features: 7 Channel Brand: KIC Part Name: X5 Reflow Profiler Model: X5 Condition: Original New Leadtime: 7days KIC X5 Thermal Profiler with SPC software and RF capability For Reflow Track More Data Points With 7,
Technical Library | 2021-08-25 16:28:36.0
In this study, a Sn–Bi composite solder paste with thermosetting epoxy (TSEP Sn–Bi) was prepared by mixing Sn–Bi solder powder, flux, and epoxy system. The melting characteristics of the Sn–Bi solder alloy and the curing reaction of the epoxy system were measured by differential scanning calorimeter (DSC). A reflow profile was optimized based on the Sn–Bi reflow profile, and the Organic Solderability Preservative (OSP) Cu pad mounted 0603 chip resistor was chosen to reflow soldering and to prepare samples of the corresponding joint. The high temperature and humidity reliability of the solder joints at 85 #14;C/85% RH (Relative Humidity) for 1000 h and the thermal cycle reliability of the solder joints from
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
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Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
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How to Minimize Humidity Interaction with PCBAs for Robustness
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SMT Express, Volume 5, Issue No. 8 - from SMTnet.com Equipment Impacts of Lead Free Wave Soldering The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today�s Wave Solder systems
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
. OSP (Organic Solderability Preservatives): A flat and cost-effective finish that offers good solderability for a limited time after application. VII
Surface Mount Technology Association (SMTA) | https://www.smta.org/certification/recertification.cfm
. James Hall are divided into 11 modules each with slides and a quiz on the following updated topics: PCB Basics and Surface Finishes like HASL and ENIG Surface Finishes like OSP, Immersion Tin, Immersion Silver Paste, stencils, printing and how they are interrelated Component placement with a focus
