Industry Directory: solderability problem tin copper (9)

Conecsus LLC

Industry Directory | Manufacturer

The largest tin/lead secondary smelter in the western hemisphere, with a focus on recycling industrial metal waste streams. Areas of expertise include electronics dross, solder paste, solder wire, solder bar.

Hi-Rel Alloys Ltd

Industry Directory | Manufacturer

manufactures solder preforms , hermetic covers , heat spreaders and custom welded assembllies

New SMT Equipment: solderability problem tin copper (39)

KappZapp7 Audiophile - the tin silver solder for speakers and audio equipment

KappZapp7 Audiophile - the tin silver solder for speakers and audio equipment

New Equipment | Solder Materials

The KappZapp7 - 7% Silver formula is an audio industry standard for vehicle and home theater speaker installations. Its 7% Silver content requires a higher temperature range, but yields superior strength and vibration resistance. Low melting temper

Kapp Alloy & Wire, Inc

Kapp Antimonial Tin - Lead Free Solder for Electrical or Electronic Connections

Kapp Antimonial Tin - Lead Free Solder for Electrical or Electronic Connections

New Equipment | Solder Materials

95% Tin / 5% Antimony a.k.a. "Antimonial Tin" is a Lead solder replacement for soldering electrical equipment, Copper tubing, and cooling coils for refrigerators. Joints are of moderate strength where the higher strength and higher cost of KappZapp™

Kapp Alloy & Wire, Inc

Electronics Forum: solderability problem tin copper (909)

Lead free tin copper only

Electronics Forum | Sun Feb 05 08:41:15 EST 2006 | Cmiller

Are you refering to reflow soldering or wave soldering? Brian, do you have any data to support that SAC305 is more reliable than Tin-Copper-Nickel? NEMI reccomended SAC type alloys for reflow and Tin-Copper for wave. See: http://circuitsassembly.

Lead free tin copper only

Electronics Forum | Tue Feb 07 13:39:42 EST 2006 | gregoryyork

You can use straight forward Tin/Copper but it flows very poorly so solderability is an issue. Dosing with Phos improves this but need to stay on top of it. We have supplied some 3.8%Ag alloys for flow they work well but you get a small 'chill point'

Used SMT Equipment: solderability problem tin copper (1)

ASC International ASCII paste thickener, 3D SPI-6500 paste thickener

ASC International ASCII paste thickener, 3D SPI-6500 paste thickener

Used SMT Equipment | Pick and Place/Feeders

Product Details of 3D SPI-6500 Thick Paste Measurement Instrument Product Functions 1, friendly programming interface 2, a variety of measurement methods 3, scan spacing adjustable 4, image 3D simulation function 5, independent 3D dynamic obser

KingFei SMT Tech

Industry News: solderability problem tin copper (234)

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

SMTA INTERNATIONAL FT WORTH

Industry News | 2011-11-03 21:52:00.0

By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.

SMTnet

Parts & Supplies: solderability problem tin copper (1)

Global Active Wave Soldering Machine GS350P

Global Active Wave Soldering Machine GS350P

Parts & Supplies | Soldering - Wave

Overseas Agent and Distributor Wanted ! Features : Spray Fiuxer: 1) Oriental motor drives the flux spraying system. Spraying speed is adjusted according to PCB board width and moving speed to ensure even spraying all time. 2) Durable “Meiji

Xtreme Marketing LLP

Technical Library: solderability problem tin copper (22)

Lead-free SMT Soldering Defects How to Prevent Them

Technical Library | 2012-10-23 14:25:38.0

Tin-Silver-Copper alloys are the primary choice for lead-free SMT assembly. Although there are other options available such as alloys containing bismuth or indium and other elements, tin-silver-copper solders, also known as SAC alloys are by far the most popular. They are used by approximately 65% of users, as last surveyed by Soldertec in 2003.

Kester

Creating Solder Joint Reliability with SnCu Based Solders Some Practical Experiences

Technical Library | 2009-01-15 00:42:58.0

Tin-silver-copper has received much publicity in recent years as the lead-free solder of choice. SAC305 was endorsed by the IPC Solder Value Product Council in the United States as the preferred option for SMT assembly; most assemblers have transitioned to this alloy for their solder paste requirements. The SAC305 alloy due to its 3.0% content of silver is expensive when compared to traditional 63/37 for this reason many wave assemblers are opting for less costly options such as tin-copper based solders for their wave, selective and dip tinning operations.

Kester

Videos: solderability problem tin copper (26)

I.C.T Off Line LED Flex Pick and Place Machine M Series

I.C.T Off Line LED Flex Pick and Place Machine M Series

Videos

  New Upgrade — I.C.T SMT LED Flexible Pick and Place Machine M series   In 2022, we have upgraded the equipment of the M series pick and place machine for SMT Production line. I.C.T M series pick and place machine is mainly used for the producti

Dongguan Intercontinental Technology Co., Ltd.

Fully automatic stencil cleaning system MLPBT-750

Fully automatic stencil cleaning system MLPBT-750

Videos

Fully automatic stencil cleaning system MLPBT-750 Application fields of "MLPBT-750 steel mesh cleaning machine": ●Suitable for cleaning various types of stencils such as steel mesh, copper mesh, microporous mesh, and wafer tray [see the following fi

Qinyi Electronics Co.,Ltd

Events Calendar: solderability problem tin copper (3)

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Surface Mount Technology Association (SMTA)

Printed Circuit Board (PCB) Inspection & Quality Control

Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,

Printed Circuit Board (PCB) Inspection & Quality Control

Surface Mount Technology Association (SMTA)

Career Center - Resumes: solderability problem tin copper (7)

Sales Manager

Career Center | Shen Zhen, China | Management,Sales/Marketing

Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe

Sr. Process & Quality Engineer

Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support

Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.

Express Newsletter: solderability problem tin copper (1029)

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485 Effects of Tin and Copper Nanotexturization on Tin Whisker Formation First published

Partner Websites: solderability problem tin copper (51)

"Lead-Free" Semiconductor Industry-SMT Technical-Reflow oven,SMT Reflow Soldering Oven-cmsadmin

| http://etasmt.com/cc?ID=te_news_industry,3561&url=_print

('lead' here refers to the external pins of the package for connecting the device to the outside world, and not the element Pb).  Lead finish is the application of a layer of metal over the leads of the device to improve its solderability, protect it from corrosion and mechanical damage, and improve its appearance.  Tin (Sn)-Lead (Pb

Call for Papers | SMTA International

Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm

@smta.org Advanced Packaging/Components: 2.5/3D Packaging and Integration BGA/CSP Biomedical Packaging Component Storage Connector Technology Copper Pillars Copper Wire Bonding Diffusion Bonding Embedded and Miniature Passives Environmental

Surface Mount Technology Association (SMTA)


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World's Best Reflow Oven Customizable for Unique Applications