New SMT Equipment: solderability shelf life of tin (5)

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

Antenna PCB Fabrication - USA Atlanta, GA - Single Sided - Double Sided - Multi Layer - Plated Through Holes

Antenna PCB Fabrication - USA Atlanta, GA - Single Sided - Double Sided - Multi Layer - Plated Through Holes

New Equipment | Fabrication Services

Antennas At ACI we've been manufacturing a wide array of Antenna PCB's since 1992. With millions of our products in operations around the world, our customers rely on us to deliver Antenna PCB’s of the highest quality and PIM performance.   From bas

Advanced Circuitry International

Electronics Forum: solderability shelf life of tin (74)

component shelf life

Electronics Forum | Thu Aug 29 17:45:54 EDT 2002 | nifhail

What are other testing/process step that we should do if we where to use the old date code QFPs other than solderability and baking ? What is the plating composition normally %? lead, % tin etc. I have my policy not to accept the more than 12 mont

SMT device shelf Life

Electronics Forum | Wed Jun 25 12:13:31 EDT 2003 | russ

A lot of it depends upon what the lead terminations are and the storage conditions. For example if they are tin you will run into trouble. We have used all types of parts that are all ages (We just started doing BGAs that are 5 years old.) I don't

Industry News: solderability shelf life of tin (36)

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Industry News | 2018-02-19 13:55:53.0

IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.

Association Connecting Electronics Industries (IPC)

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Technical Library: solderability shelf life of tin (3)

Keeping Tin Solderable

Technical Library | 1999-05-06 15:31:13.0

Tin plating on a component lead makes its soldering easier. Everybody knows that. Not so well known is that tin plating has shelf life -- its ability to be easily soldered degrades over time. the speed and severity of degradation depends both on storage conditions and on the plating itself...

TE Connectivity

Equipment Impacts of Lead Free Wave Soldering

Technical Library | 2003-04-18 12:05:57.0

The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today's Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder machine components. This paper describes the effects of Sn rich solders in contact with various materials and discusses alternate methods to alleviate this problem.

Cookson Electronics

Videos: solderability shelf life of tin (1)

SIPAD Systems, Inc.

SIPAD Systems, Inc.

Videos

SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi

SIPAD Systems Inc.

Express Newsletter: solderability shelf life of tin (992)

BGA Package Component Reliability After Long-Term Storage

BGA Package Component Reliability After Long-Term Storage BGA Package Component Reliability After Long-Term Storage In 2008, the white paper Component Reliability After Long Term Storage was published in support of shelf life extension

Partner Websites: solderability shelf life of tin (35)

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

. Schueller, Ph.D., W. Ables, and J. Fitch, Ph.D. Abstract 22-1 INVESTIGATION OF IMC GROWTH IN TIN SURFACE FINISH AND ITS EFFECT ON SOLDERABILITY IN FC-CSP PACKAGING HyunJung Lee, YeonSeop Yu, HyoJung Kim, Hee-Soo Kim Abstract 22-1 COMPREHENSIVE METHODOLOGY TO

Surface Mount Technology Association (SMTA)

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

with an appropriate solvent.   Rosin/Resin (R) Natural or modified pine tree sap. Resins are processed Rosins. Rosin is the mildly acidic sap found in pine trees and was the first fluxing agent used in the Bronze Age.     S Shelf Life Duration of time a

ASYMTEK Products | Nordson Electronics Solutions


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