Industry Directory | Manufacturer
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
Industry Directory | Distributor / Manufacturer
An international distributor of mechanical IC samples or "dummy" components, SMD production tools and equipment
New Equipment | Assembly Services
PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol
The system features high clearance for assemblies with up to 300mm height. Main application is the foil and PTH inspection. X-ray system features Inspection program control system with automatic defect detection and defect verification capability
Electronics Forum | Thu Jun 13 08:32:24 EDT 2013 | rway
Have you verified the measurements on the bench with an LCR meter? Chances are you are experiencing aging with these ceramic caps. We have similar issues with X5R and X7R caps. You will see the effects of aging with returns from the field as well
Electronics Forum | Thu Jun 23 23:58:03 EDT 2011 | jamessunderland
Just want to ask. What is the effect of dull gold surface on solderability? When I made a test run with several pieces containing dull gold defect on the pad(of varying levels), I found that components can still stick to the pad with good amount o
Used SMT Equipment | Pick and Place/Feeders
=1.0 ±50/Chip Cpk>=1.0 ±35/QFP Cpk>=1.0 ±50/Chip Cpk >=1.0 ±35/QFP Cpk >=1.0 Productive Highest Tact (CPH/sec) 25,000/0.144 19,000/0.189 7,200/0.5 Effectiveness Tact (CPH/sec) 17,000/0.21 14,000/0.26 5,000/0.72 PCB trans
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
Industry News | 2017-01-17 15:17:33.0
The SMTA is pleased to announce the Call for Abstracts for the International Conference on Soldering and Reliability June 6-8, 2017 in Markham, Ontario, Canada. The deadline to submit an abstract is February 28, 2017.
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Parts & Supplies | Pick and Place/Feeders
Many companies first applied SMT second-hand placement machines, and the selected placement machines were relatively stable, with low failure rate, easy maintenance, and important maintenance costs. Therefore, there are still many concerns about buyi
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Radiator Reflow Soldering Oven for SMD Assembly Line ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Speci
Heat Sink SMD Reflow Oven ❙ Introduce of Reflow Oven ETA provide high reliability special reflow oven, SMD reflow soldering oven, radiator reflow oven, hot air reflow oven, for radiator production line. Special reflow oven/IR curing o
Events Calendar | Wed May 15 00:00:00 EDT 2019 - Fri May 17 00:00:00 EDT 2019 | Seoul, South Korea
Electronics Manufacturing Korea - Korea's largest electronics manufacturing exhibition
Events Calendar | Tue Aug 28 00:00:00 EDT 2018 - Thu Aug 30 00:00:00 EDT 2018 | ShenZhen, China
NEPCON South China 2018
Career Center | Irvine, California USA | Quality Control
In Process Testing / QA Inspector In-circuit testing of SMD type assemblies Functionally test SMD type assemblies Visually inspect SMD type assemblies Load and unload (burn-in, etc.) Must be physically fit, able to lift up to 10 pounds Must have goo
Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support
tel u later
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/application/smd-shear
Shear testing is the main test performed for SMD due to component design issues. For example, leadless devices cannot be pull tested as there are no leads to pull upwards and as such must be shear tested to prove their effectiveness
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/webinars.cfm
Download Webinars/Webtorials On-Demand 中文 MEMBERS LOGIN Membership Become a Member! Renew Membership About SMTA Ambassadors Benefits Classifications Member Directory Member Directory Corporate Suppliers Corporate Users Consultants List Advertisers Update Your Info
COT specializes in high quality SMT nozzles and consumables for pick and place machines. We provide special engineering design service of custom nozzles for those unique and odd components.
2481 Hilton Drive
Gainesville, GA USA
Phone: (770) 538-0411
