1052 solderballs that form on sides of components during reflow results

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com

SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo

SMT Express, Volume 2, Issue No. 1 - from SMTnet.com

Featured Article Return to Front Page REFLOW SOLDERING

pages following that figure the IPC illustrates an allowance for Toe Overhang and it goes on to state that there is no minimum toe fillet requirement other than "evidence of a fillet" but the placement

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

Optimizing Reflowed Solder TIM (sTIMs) Processes for Emerging Heterogeneous Integrated Packages

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf

. More rugged applications such as automotive ADAS use the TIM1/2 package approach, while many AI modules use a pressurized TIM0 (TIM1.5) approach. Note that while the latter eliminates the need for reflow of the TIM during assembly, it also necessitates precision controls in manufacturing to minimize mechanical stress on the die during

Heller Industries Inc.