Industry Directory | Manufacturer
Reflow ovens for automated SMT PCB assembly, specializing in lead free processing and nitrogen reflow. The best convection reflow ovens on the market.
Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
SMT Stencil Printer/ PCB Printers/ Solder Paste Stencil Printer Semi-Auto Main product: Stencil Printer, Semi-Automatic Printing, PCB Printer, screen printing, SMT Stencil Printer, SMT screen printer, SMT printer, Solder Paste Printer, SMT solder p
2,0 Cpk @ ±17,5 μmDemision:1300mm×1000mm×1600mmProduct description: ASM DEK TQ SMT Stencil Printer, Max PCB: 400x400 mm, Core cycle time：5 secs, Demision:1300mm×1000mm×1600mm, Wet print capability > 2,0 Cpk @ ±17,5 μm ASM DEK TQ SMT Stencil Prin
Electronics Forum | Tue Nov 08 01:46:43 EST 2016 | sarason
Some machines use air blowing to not only place the part but to also help guarantee that when the nozzle is sucking it doesn't end up with a net accumulation of solder paste inside the nozzle. Juki and Yamaha spring to mind. sarason
Electronics Forum | Tue Aug 15 15:48:20 EDT 2006 | Chunks
No longer than when it starts to cause defects unacceptable to company goals and/or objectives.
Used SMT Equipment | Stencil Cleaners
SmartSonic Ultrasonic Stencil Wash • Model: 529 • Year: 2018 • Enviroguard-P Filtration System • Hand-Held Spray Rinse • Hand-Held Air Blow-Off • Footprint: 21.8" x 35.5" x 31"H • Wash Tank Dim
Used SMT Equipment | Screen Printers
Panasonic SPG NM-EJ6PA Screen Printer Vintage: 2015 Model: SPG NM-EJ6PA Low Hours: Only 8,322 Max PCB: 50mm x 460mm Key Features: Hybrid squeegee head Hybrid squeegee head, which has a good track record with our highly functional models, is equipped
Industry News | 2013-10-10 09:56:45.0
GPD Global has again pushed the limits for small-volume dispensing with its new Nano-Piston pump. Dots of conductive adhesive down to 100 μm and solder paste for 01005s are possible with the Nano-Piston Pump.
Industry News | 2003-02-20 08:04:10.0
The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.
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Parts & Supplies | Soldering - Reflow
This reflow oven is top quality oven represent the world's best low cost, high performance solder reflow sytem. The sensor is designed in the front of tip and the temperature induction is very exact and sensitive, the speed of heating and recovery of
Parts & Supplies | Soldering - Reflow
Brand New SMT2010 TABLE-TOP REFLOW OVEN LEAD-FREE Description: This is a brand new, SMT2010 Reflow oven. More and more surface mount devices (SMD) are used on electronic circuit boards. Large floor model reflow ovens are expensive and heavy, no
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
To see more visit Pillarhouse here: https://www.pillarhouse.co.uk/products/selective-soldering-handload/pilot-handload Economical, compact, single point selective soldering system The all-new ultra-low-cost Pilot machine has been designed as an ent
PCB magazine unloader/Multi magazine unloader how to receive the PCB after soldering, more detail check :https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/91.html Multi Magazine PCB unloader is used at the end of the SMT line for unlo
Training Courses | | | IPC-A-610 Specialist (CIS)
The Certified IPC-A-610 Specialist (CIS) training focuses on the acceptance requirements for the manufacture of electrical and electronic assemblies
Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,
Solder Paste Qualification Testing - SMTA Webinar
Events Calendar | Wed May 04 00:00:00 EDT 2022 - Wed May 04 00:00:00 EDT 2022 | ,
Virtual Course: Cost Modeling Your Assembly Line or Factory to Reduce Costs & Improve Profitability
Career Center | Seymour, Connecticut USA | Engineering
Develop and manage SMT assembly and soldering processes and associated staff in medium volume/high-mix printed circuit board assembly operation for complex quality class 2/3 assemblies. DUTIES AND RESPONSIBILITIES: Plan and develop processes a
Career Center | Gaylord, Michigan USA | Management,Production
We are looking for a motivated 2nd shift production supervisor with the desire to make a significant contribution to the continued success and growth of our company. You will be responsible for supervising production and employees for large electron
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Career Center | Sugar land, Texas USA | Engineering,Maintenance,Management,Production,Sales/Marketing,Technical Support
Production Management, SMT, Manufacturing Engineering, Programming, CircuitCam, Inventory Control, AOI, Fuji AIM/ NXT, Assembleon, Universal, Quad, Mydata, Heller, DEK, Mirtec, Aqueous Tech, MPM, Resys, Vapor Phase, Juki, Selective Soldering, HMP, El
Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints SMTnet Express September 13, 2012, Subscribers: 25475, Members: Companies: 8976, Users: 33645 Thermal Cycle Reliability Study of Vapor Phase BGA Solder Joints First published
SMTnet Express, July 9, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles Craig Hillman, Nathan Blattau; DfR Solutions , Matt Lacy; Advanced Energy
| https://unisoft-cim.com/cycle-times.html
PCB Cycle Times for Component Insertion on PC Board | Unisoft ≡ Menu Skip navigation For over 35 years, Intelligent PCB Manufacturing Automation Software Be production ready in minutes, not days
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/soldering
. By using the Hot Bar Reflow Soldering process multiple connections (up to > 100mm width) can be made simultaneously in a single process cycle
