We make wave solder fixtures, smt, reflow fixtures, press fit and special tool for electronic assembly. We specialize in quick turn for prototype.
Industry Directory | Consultant / Service Provider / Manufacturer
Manufacturing SMT Stencil, Reballing stencil. SMT pallet; Wave solder pallet and Engineering Services
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Electronics Forum | Thu Nov 01 17:33:23 EST 2001 | davef
We buy clips and spring tensioners from wave solder pallet manufacturers [ie, EMC Global, Garland, MB, etc]. Search the fine SMTnet Archives for contacts.
Electronics Forum | Tue Oct 28 10:45:22 EST 2003 | Gabriele
After following the suggestions above, and where it would not be possible to mask BGA by soldering fixture, a Kapton tape (pre-punched) can be placed under BGA ( wave solder source side ) it can help to keep temperature low enough avoiding "seconda
Used SMT Equipment | Screen Printers
Substrate processing: Maximum substrate size (XxY): 609.6mmx508mm(24”x20”) For circuit boards larger than 20”, special fixtures are required Minimum substrate size (XxY): 50.8mmx50.8mm(2”x2”)
Used SMT Equipment | Other Equipment
High Speed Cream Solder Mixer (1) This machine main control in part by the microcomputer with the control software to achieve high control precision, speed, anti-interference ability, to ensure the machine's control performance. (2) This machine di
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2011-05-17 11:04:30.0
High Yield BGA Reballing Simplified
Parts & Supplies | Solder Paste Mixers
Solder Cream Mixer Feature of Solder Cream Mixer Excellent for ISO 9000 solder paste mix process condition. Strong mixing power. Increasing printing quality. Cream Solder Mixer Led display panel and microprocessor control, easy to operate. Unive
Parts & Supplies | Solder Paste Mixers
Solder Cream Mixer Feature of Solder Cream Mixer Excellent for ISO 9000 solder paste mix process condition. Strong mixing power. Increasing printing quality. Cream Solder Mixer Led display panel and microprocessor control, easy to operate. Unive
Technical Library | 2019-08-15 13:31:52.0
Cracks in ceramic chip capacitors can be introduced at any process step during surface mount assembly. Thermal shock has become a "pat" answer for all of these cracks, but about 75 to 80% originate from other sources. These sources include pick and place machine centering jaws, vacuum pick up bit, board depanelization, unwarping boards after soldering, test fixtures, connector insulation, final assembly, as well as defective components. Each source has a unique signature in the type of crack that it develops so that each can be identified as the source of error.
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Davenport, Iowa USA | Production
SURFACE MOUNT SOLDERER - COOLERS Cobham Mission Systems is seeking a Surface Mount Solderer for our Coolers Department within our Davenport, Iowa facility. This position is open due to an increase in staff. The qualified applicant will perform the
Career Center | Moorpark, California USA | Engineering
Responsible for the set up of the SMT line, Wave Solder Machine and actual production. Maintain, program and operate line equipment. Troubleshoot and repair equipment, coordinating with vendors when necessary. Develop standards for stencil app
Career Center | tulsa, Oklahoma | Engineering
Printed Circuit Assembly Process Engineer. Seeking a position in a high-technology operation, utilizing my background supporting a progressive and growth-oriented organization. Offering the technical experience, expertise, and skills gained during th
Career Center | Wayland, Michigan USA | Engineering,Maintenance,Research and Development,Technical Support
-Young, energetic, and eager individual ready and willing to learn new skills and exercise my current skill set. -Trained and proficient in the following pieces of equipment: MyData Pick and Place, Dek screen printers, Cyberoptic and Koh Young SPI,
Heller Industries Inc. | https://hellerindustries.com/parts/459706/
459706 - FIXTURE ASSY - For board width adjustment Phone 1-973-377-6800 Company About News Events New Equipment Convection Reflow Ovens Reflow Oven MK7 -New
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/soldering
responsive temperature control… C-Prime with touchscreen C-Prime Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a fixed position, with an optional fixture
