Industry Directory: soldering frames (21)

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Industry Directory |

Custom machinery and equipment manufacturer and, supplier of MiniTec aluminum structural framing & systems and patented Sn/Zn/Al soldering ball for SMT

SHENZHEN CATOS TECHNOLOGY CO., LIMITED

Industry Directory | Manufacturer / Other

solder pallets material ( alternative Durostone material, FR-4 laminated sheet ); solder pallets accessories(sold pallet hold down, clamps for solder pallets; PCB assembly tooling(wave solder pallet)

New SMT Equipment: soldering frames (103)

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Electronics Forum: soldering frames (155)

wave frames CAS - cleaning

Electronics Forum | Mon May 14 10:05:12 EDT 2007 | d0min0

hi, i'd like to know how do you maintain cleaness of your solder frames after production - we use both SnPb and leadfree process, we clean in alcohol and ultrasonic but the frames look white and i wonder if we do not damage the structure??? best re

wave frames CAS - cleaning

Electronics Forum | Fri May 18 04:40:51 EDT 2007 | gregoryyork

Wash them in Saponifier frequently at around 40C rinse and dry thoroughly. I would imagine it could be going white if you have a resin system in the flux that is not water soluble. Ensure you are using suitable pallet material up to 300C for Lead Fre

Used SMT Equipment: soldering frames (46)

DEK Horizon 03iX Solder Paste Printer

DEK Horizon 03iX Solder Paste Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up  PCB support Tooling&n

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

DEK Horizon 03iX Screen Printer

DEK Horizon 03iX Screen Printer

Used SMT Equipment | Screen Printers

DEK Horizon 03iX Fully Automatic Screen Solder Paste Printer Model Horizon 03iX Operating System Win XP+09sp13 or up  PCB support Tooling&n

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Industry News: soldering frames (175)

GPD Global's MAX Series Provides Maximum Accuracy

Industry News | 2011-04-22 21:36:56.0

GPD Global announces that its MAX Series Dispensing Systems are the dispensers of choice for high accuracy and repeatability applications.

GPD Global

Largest Dispensing Platform in the Industry

Industry News | 2017-04-11 21:19:32.0

GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.

GPD Global

Parts & Supplies: soldering frames (24)

Soltec FINGER L SHAPED (HEAVY) 7-C450126 FOR SMT solder machine

Soltec FINGER L SHAPED (HEAVY) 7-C450126 FOR SMT solder machine

Parts & Supplies | Assembly Accessories

Wave soldering machine titanium claw series: There are more than 200 titanium claws such as Rito, Jintuo, Hexi, Duoduo, Chaochao, Honghui, evergreen, Xinhe, teke, Huabang, Hongda, Yifeng, green, Noda, Dongye, Yongxin, imported wave soldering mach

KingFei SMT Tech

DEK BOOM  BOARD CLAMPS 500MM

DEK BOOM BOARD CLAMPS 500MM

Parts & Supplies | Pick and Place/Feeders

101004 TRANSISTOR BC108 NPN 101020 POWER SUPPLY – UPRATED CURRENT 101047 SQUEEGEE MATERIAL 9.5 X 9.5 85-90 101081 CONNECTOR CIRCULAR 14WAY 97-3102A 101142 FRONT SQUEEGEE CARRIAGE 101143 OUTER MTG SQUEEGEE BLOCK 101145 COVER (TXT) 101146

Qinyi Electronics Co.,Ltd

Technical Library: soldering frames (4)

Failure Modes in Wire bonded and Flip Chip Packages

Technical Library | 2014-12-11 18:00:09.0

The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...) The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared

Peregrine Semiconductor

Wettable-Flanks: Enabler for the Use of Bottom-Termination Components in Mass Production of High-Reliability Electronic Control Units

Technical Library | 2018-05-23 12:12:43.0

Driven by miniaturization, cost reduction and tighter requirements for electrical and thermal performance, the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON), quad-flat no leads (QFN) packages etc., is increasing. However, a major distractor for the use of such packages in high-reliability applications has been the lack of a visible solder (toe) fillet on the edge surface of the pins: because the post-package assembly singulation process typically leaves bare copper leadframe at the singulation edge, which is not protected against oxidation and thus does not easily solder-wet, a solder fillet (toe fillet) does not generally develop.

Robert Bosch LLC Automotive Electronics Division

Videos: soldering frames (153)

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

High SPEED Glue dispensing with GPD Global Max series Glue Dispenser

Videos

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

Contour Mapping for Precision Fluid Dispense

Contour Mapping for Precision Fluid Dispense

Videos

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

Career Center - Resumes: soldering frames (3)

larry garland

Career Center | maple heights, Ohio USA | Production,Technical Support

Certified SMT operator, experience in surface mount and through hole soldering, took courses in AC/DC Electronics, Electronic Devices I and II, Microprocessors, Programmable Logic Controllers, Electronics Communications Systems, Control Systems, Netw

rozenblit1

Career Center | , Israel | Engineering,Maintenance,Technical Support

I was born on June , 1972 in Khmelnitsky city , Ukraine . I am male. From 1979 to 1987 I was studying at secondary school #7, having finished which I entered the Technical College of Khmelnitsky in specialty Machine Tools with Computer Numeric Contr

Express Newsletter: soldering frames (983)

Partner Websites: soldering frames (78)

Top 10 SMT New Product Stories of 2014 - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/top-10-smt-new-product-stories-of-2014_topic1520_post6150.html

#6, Manncorp Reconfigures, Expands SMT Solutions: The company has recently reconfigured and expanded its exclusive selection of SMT turnkey packages, including stencil printing, pick-and-place, and reflow soldering equipment, to accommodate a wider

PCB Libraries, Inc.

What are the features of the Full-auto SMT Stencil Printer? - I.C.T SMT Machine

| https://www.smtfactory.com/What-are-the-features-of-the-Full-auto-SMT-Stencil-Printer-id46262477.html

& Place Machine JUKI Pick & Place Machine YAMAHA Pick & Place Machine PANASONIC Pick & Place Machine FUJI Pick & Place Machine I.C.T Pick & Place Machine SMT Peripherals DIP Machine Acrab Series W Series Automatic Insertion Machine Selective Wave Soldering Machine DIP Peripheral Equipment PCB Handling Machine Loaders


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Fluid Dispensing, Staking, TIM, Solder Paste

Reflow Soldering 101 Training Course
Void Free Reflow Soldering

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
SMT feeders

High Throughput Reflow Oven
2024 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications
2024 Eptac IPC Certification Training Schedule

High Resolution Fast Speed Industrial Cameras.