Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
Process Capability: Several professional auto Siemens series Siplace SMT placement and the plated-through-hole(PTH) insertion parts, test, package lines Productivity: mount above 1.5million/day SMC components in our SMT production lines Small SMC/
Electronics Forum | Wed May 09 01:23:17 EDT 2001 | GregH
Hi, My Bottomside component pads are 1:1 with my topside land sizes/dimensions. I have difficulties catching solders on my bottomside smd chips (SMB Diodes, 0805 RC Chips). What should the bottomside components for wave soldering be greater than my t
Electronics Forum | Wed Jul 03 14:08:10 EDT 2002 | gbriceno
I' designing a PCB with SMD components to optimize the land patterns for wave soldering. I find that the IPC-SM-782 land patterns are not robust enough for wave soldering, yielding ramdom skips and bridges. This PCB will also give me insight on sha
Industry News | 2016-08-25 17:56:34.0
GPD Global's advanced Precision Auger Pump retrofits into your dispensing system to provide excellent dispense control and repeatability. Precision Auger Pump Integration provides your process development with a broad range of functionality.
Industry News | 2018-12-08 03:27:35.0
Printed Circuit Board (PCB) for Surface Mount Technology (SMT)
Technical Library | 2008-03-18 12:36:31.0
This paper examines the construction of a notebook mainboard with more than 2000 components and no wave soldering required. The board contains standard SMD, chipset BGAs, connectors, through hole components and odd forms placed using full automation and soldered after two reflow cycles under critical process parameters. However, state of the art technology does not help if the process parameters are not set carefully. Can all complex BGAs, THTs and even screws be soldered on a single stencil? What will help us overcome bridging, insufficient solder and thombstoning issues? This paper will demonstrate the placement of all odd shape components using pin-in-paste stencil design and full completion of the motherboard after two reflow cycles.
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Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors Laser Micromachining of Nanocomposite-Based Flexible Embedded Capacitors This paper discusses laser micromachining of barium titanate (BaTiO3)-polymer nanocomposites and sol-gel
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/smd-land-pattern-calculation-for-wave-solder_topic1746.html
(SMD components mounted on board with glue, and then go through wave soldering)? Normally, SMD land pattern size will be larger than normal design if use wave soldering
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/front-end-components?con=t&page=7
% material costs by utilizing bulk supply equipment designed specific for aircraft manufacturing Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components Nordson SELECT Bob Klenke
