Industry Directory | Manufacturer's Representative
Specialty materials for SMT Assembly. Solder Paste, Spheres, Tac Fluxes, Flip Chip Fluxes, Solder wi
Industry Directory | Manufacturer
US manufacturer of metallized ceramic substrates & packages; specializing in PCTF (plated copper over thick film) & low cost AgENIG (silver with electroless nickel and immersion gold plating).
Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Electronics Forum | Tue Nov 29 21:51:37 EST 2005 | wmeyers
I have a pin and sleeve assembly that utilizes a fusible link type of solder, Bi, Cd, Pb and Sn alloy. The pin is gold plated, the sleeve is copper alloy 725. I have had sporadic success with wetting of the sleeve during the reflow process. To improv
Electronics Forum | Mon Apr 28 09:59:04 EDT 2003 | davef
Your customer's question is reasonable. Soldering to nickel is not always a walk on the beach [can of corn, or whatever]. This issue is flux not solder. Your Sn63 will have plenty of strength, providing the solder connection is well formed. You s
Used SMT Equipment | SPI / Solder Paste Inspection
Make: VI Technologies Model: 3D Solder Paste Inspection Vintage: 2009 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow free ins
Used SMT Equipment | Visual Inspection
Make: VI Technolgoies Model: 3D XPi 400L Solder Paste Inspection Vintage: 2008 Details: 1. FAHP (flying absolute height profilometry) measurement method 2. Dual light source and on the fly image scan 3. High power M/H light 3D sensor 4. Shadow
Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Parts & Supplies | SMT Equipment
PA Main Parts Part Name：NICKEL HYDRIC STORAGE BATTERY PART No：N9973GB6-005 Part Name：PIN PART No：1023810003 Part Name：VANE PART No：N45214022A Part Name：CAM FOLLOWER & LOCK-NUT PART No：N531CFH6RA Part Name：PIN PART No：102381000
Parts & Supplies | SMT Equipment
PA Main Parts Part Name：NICKEL HYDRIC STORAGE BATTERY (电池) PART No：N9973GB6-005 Part Name：PIN (MSH头部螺丝-长) PART No：1023810003 Part Name：VANE (真空泵碳片) PART No：N45214022A Part Name：CAM FOLLOWER & LOCK-NUT (支撑凸轮及螺母) PART No：N531CFH6RA Part Nam
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2013-01-18 02:42:14.0
ENIG (Electroless Nickel/Immersion Gold) is to deposit nickel gold plating which has good solderability, wear resistance , leveling appearance and small electric resistance. It included 4 steps that are pretreatment, immersion nickel, immersion gold and Post treatment...
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,
Webinar: BGA and Area Array Process Defects - Causes & Cures
Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,
Printed Circuit Board (PCB) Inspection & Quality Control
Career Center | Warminster, Pennsylvania USA | Production,Quality Control
PCB component level assembly - soldering under microscope. *Soldering and mechanical assembly using excellent solder skills, manual dexterity, depth perception and attention to detail. *Perform or inspect component replacement and rework on units.
Career Center | Costa Mesa, California USA | Engineering,Sales/Marketing,Technical Support
SALES- Growth opportunity to join a growing Manufacturers Rep firm. Looking for an aggressive sales professional to cover San Diego and the Mexican boarder areas of Tijuana, Tecate and Mexicali. Previous sales experience required selling to ele
Career Center | NORTHRIDGE, California USA | Engineering
EDUCATION BS Electronics and Communication Engineering Gujarat University MS Electrical Engineering California State University, Northridge ACADAMIC PROJECT Fabrication and Characterization of Silicon Carbide (SiC) MESFE
Career Center | Houston, Texas USA | Engineering,Management,Quality Control,Technical Support
Seasoned Process & Quality Engineer. Degreed Chemical Engineer. 20+ years in Electronics Semiconductor manufacturing. Proficient in Quality Statistical tools, Design of Experiments, FMEAs, APQP, PPAP, ISO 9000, ISO/TS 16949 etc.
SMTnet Express, November 6, 2014, Subscribers: 23500, Members: Companies: 14091, Users: 37109 Effect of Process Variations on Solder Joint Reliability for Nickel-based Surface Finishes Hugh Roberts, Sven Lamprecht, Gustavo Ramos, Christian Sebald
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/soldering?con=t&page=8
Soldering Equipment – Selective Hot Bar Soldering | Nordson Nordson Corporation Global Directory | Languages NASDAQ $212.44 +5.43 Our Products Our Industries Our Applications Brands
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