Industry Directory | Manufacturer
ECT is the world's leading manufacturer of POGO ® contact probes for a wide range of applications including industrial, medical, military, connectors and testing bare and loaded printed circuit boards
Industry Directory | Consultant / Service Provider / Training Provider
Consulting in Process and Manufacturing Engineering. Equipment repair and remote troubleshooting on various equipment types and manufacturers. Training remote and on-site on many types of equipment and processes.
New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
New Equipment | Assembly Services
JUKI RS-1R SMT Assembly Line JUKI RS-1R SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 47000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place machin
Electronics Forum | Mon Oct 29 19:48:03 EST 2001 | davef
Sounds like the connector is not solderable. * Do they take solder when hand soldering? * Do they take solder when using a hotter flux than you normally use? * What flux are you using? * What are the materials used in fabricating these connector le
Electronics Forum | Mon Oct 29 16:34:02 EST 2001 | patcope1
I have a custom connector that tends to lift during reflow. The PCB retention tabs and pins are lifting off of the pads on the board and the solder is forming underneath the pads, with no heel or toe filet. Is there anyone out there that can help if
Used SMT Equipment | X-Ray Inspection
Description Make: VISCOM Model: 7056-II RL Year: 2010 Type: Wave Solder Details: Refurbished in 2021 by Viscom: In-line or can be used as standalone -The entire image chain is new.-New computers with Windows 10 IOT-New Digital flat p
Used SMT Equipment | X-Ray Inspection
Description Make: VISCOM Model: 7056-II RL Year: 2010 Type: Wave Solder Details: Refurbished in 2021 by Viscom: In-line or can be used as standalone -The entire image chain is new.-New computers with Windows 10 IOT-New Digital flat p
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2003-05-23 08:24:49.0
Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.
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Parts & Supplies | Pick and Place/Feeders
DEK -SPARE PARTS X Axis Timing belt 2350mm..145518 DEK X Axis Timing belt 145518 | QYSMT, dek horizon 03ix, dek screen printer, dek printer, dek 03ix, dek parts, dek horizon, dek generator parts, asm dek printer, dek solder paste printer, 145518
Parts & Supplies | Pick and Place/Feeders
KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl
Technical Library | 2020-05-07 03:46:27.0
The selective soldering process has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty, however some types of challenging components require additional attention to ensure optimum quality control is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures and/or pallets often places an additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors,can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues due to their beryllium copper termination pins.
Technical Library | 2022-08-08 15:06:06.0
Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.
ITW EAE, the Electronic Assembly Equipment division of ITW is introducing an innovative new twin-nozzle developed by the Vitronics Soltec team for the ZEVA Selective Soldering System. The 3D-Twin-Nozzle™ has two nozzle diameters combined in one
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT)
The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.
Training Courses | | | IPC-600 Specialist (CIS)
The Certified IPC-600 Specialist (CIS) training targets quality assurance and acceptance of bare printed circuit boards.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | Dallas, Texas USA | Engineering
Job Responsibilities: Provide engineering support for all aspects of manufacturing printed circuit assemblies. Determine tooling needs and have in place prior to Pronto run (wavesolder pallets, press fit connectors etc.). Develop work instructions a
Career Center | Gwinnett County, Georgia USA | Production
SHIFTS: 1st and 2nd Shifts (Over-Time as required) STATUS: Indefinite Temporary PAY: $11.00-$12.00 per hour JOB DESCRIPTION • Perform SMT soldering, desoldering, rework, and assembly of fine pitch electronic components on Printed Circuit Boards (PCB
Career Center | Alleppey, Kerala India | Engineering,Production,Quality Control
Good knowledge about the operations of various PCB surface mounting machines Good communication skills
Career Center | , | 2014-01-31 02:17:45.0
Good knowledge about the operations of various PCB surface mounting machines Good communication skills
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 31, (#ts#)) SMT Express, Volume 2, Issue No. 11 - from SMTnet.com Volume 2, Issue No. 11 Friday, November 17, 2000 Featured
Advanced Electronic Connector Technologies News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! Advanced Electronic Connector Technologies Military electrical connectors have
| https://www.eptac.com/soldertips/soldertips-soldering-with-butane-soldering-irons/
. Be careful on coax cable with Teflon dielectrics in the cable, as if that gets too hot during the soldering of the center contact, it will expand and may impact the ability to solder the connector
| http://etasmt.com/cc?ID=te_news_industry,24361&url=_print
designed stencil The earlier process steps within surface mount assembly are critical to an effective reflow soldering process. The solder paste printing process is key to ensure a consistent deposit of solder paste onto the PCB. Any fault at this
