SMTnet Express, July 9, 2015, Subscribers: 23,004, Members: Companies: 14,461 , Users: 38,507 Predicting Fatigue of Solder Joints Subjected to High Number of Power Cycles Craig Hillman, Nathan Blattau; DfR Solutions , Matt Lacy; Advanced Energy
SMT Express, Issue No. 2 - from SMTnet.com Volume 1, Issue No. 2 Wednesday, July 14, 1999 Featured Article Return to Front Page THE LABORATORY A PRIMARY EVALUATION AND QUALIFICATION FACTOR TO DETERMINE PCB SUPPLIER PROCESS CAPABILITIES Earl
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. This is where an additive in the injection-molded plastic is selectively activated by a laser. The LDS approach has been used to manufacture 100s of millions of devices every year
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) to printed circuit boards (PCBs). The aim of the process is to form acceptable solder joints between SMC and PCB. The reflow soldering process normally adopt following steps: 1
