Industry Directory | Association / Non-Profit / Training Provider / Events Organizer
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer / Manufacturer's Representative
Main Products: 1. Original new and Original Used SMT/AI Spare Parts. 2. SMT Equipments And Related Machine( Loader/Unloader,SMT Calibration, SMT Feeder Carts,Conveyer etc.) 3. Maintenace and Repair Service
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Used SMT Equipment | Soldering - Reflow
HEXI, Lead-Free reflow soldering machine, type RFN1020/N, s.n. 0611018, Left to Right, with 10 heating heads plus cooling head, lenght of heating zones 3365mm,max width of PCB 450 mm, width of conveyor 50 to 450 mm, height of conveyor 920 +/_ 20 mm,
Used SMT Equipment | Soldering - Selective
Make: Nordson Model: Select Novo 102 Vintage: 2020 Description: Selective Solder Details: Lead-Free Titanium Solder Pot & Pump Assembly Solder Pot Capacity: 30 lbs Software: SWAK-OS 4.0 (Includes Automated Fiducial Alignment, Board Warp Compensa
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:22:28.0
The impact of voiding on the solder joint integrity of ball grid arrays (BGAs)/chip scale packages (CSPs) can be a topic of lengthy and energetic discussion. Detailed industry investigations have shown that voids have little effect on solder joint integrity unless they fall into specific location/geometry configurations. These investigations have focused on thermal cycle testing at 0°C-100°C, which is typically used to evaluate commercial electronic products. This paper documents an investigation to determine the impact of voids in BGA and CSP components using thermal cycle testing (-55°C to +125°C) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments. A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Events Calendar | Mon Apr 06 18:30:00 UTC 2020 - Mon Apr 06 18:30:00 UTC 2020 | ,
Harsh Environment Failure - Causes & Cures - FREE Pre-Conference Webinar
Events Calendar | Mon Apr 20 18:30:00 UTC 2020 - Wed Apr 22 18:30:00 UTC 2020 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference
Career Center | New Castle, Pennsylvania USA | Production
Surface Mount Tech - Printed Circuit Board (PCB) Summary: **All applicants must be familiar with: Quad 4C equipment*** Will be responsible for Surface Mount Parts and Screen Printing Other responsibilities may include: Moves controls to activate
Career Center | Norcross, Georgia USA | Production
Solder Technician Reports to: Supervisor Responsibilities: 1) Melts and applies solder along adjoining edges of workpieces to solder joints, using soldering iron, gas torch, or electric-ultrasonic equipment. 2) Grinds, cuts, buffs, or bends edge
Career Center | Delhi, India | Engineering,Production,Quality Control
Programming, Operation, Maintenance,Troubleshooting of SMT machines. Programming of cyber optics/saki(AOI) Programmingn of pcb seperater Temperature profiling (Making & Soldering) Testing,Troubleshooting of microcontroller based PCAs
Career Center | Littleton, CO USA | Production
Possess 18 years relevant work experience in manual/Auto bonding on Micro-Electronic & RF to support new product development in R&D Lab in defense & commercial sectors. Have an advanced soldering skill in both Through-Hole/SMT, and J-STD-001 cert
SMTnet Express, May 13, 2021, Subscribers: 27,139, Companies: 11,353, Users: 26,641 Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding
Heller Industries Inc. | https://hellerindustries.com/fluxless-soldering/
Fluxless Soldering Home » Fluxless Soldering Fluxless Soldering Issues from using Flux Traditionally, using flux was a necessary part of soldering
Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/high-temp-soldering/
. The act of implementing HMP solder will require soldering temperatures that are higher than standard Sn/Pb eutectic solders. Manufacturers soldering at high temperatures need to be aware of a few simple rules to prevent catastrophic component or board failures
