Industry Directory | Standards Setting / Certification / Training Provider
EPTAC is an internationally recognized solder training and IPC certification corporation, giving professionals the skills to accelerate their careers, and businesses the talent to succeed.
Industry Directory | Distributor
Manufacturer of soldering materials, paste solder
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
New Equipment | Education/Training
Blackfox’s Lead Free Soldering series minimizes the risks of conversion, and gives you the confidence to introduce lead free products and services quickly, with highest quality. The lead free certification program offers the latest requirements for S
Electronics Forum | Sat May 06 06:58:13 EDT 2000 | Wayne S.
Hello, I am looking for a small solder pot with a fountain or wave. I have seen mini-waves but would like to find something smaller and less expensive. Would like to dip solder wires to small bulb leads. If anyone has any suggestions please follow-
Electronics Forum | Mon May 08 00:53:59 EDT 2000 | Jeff Sanchez
Hi Wayne, Why do you feel that your solder pot needs a fountain for this application? It is always nice to have a mini fountain wave but it is not always a must. Good flux and a steady hand go along way. Iether way you will need a steady hand! Th
Used SMT Equipment | Soldering - Selective
• Dual Pot Lead/Leadfree • Drop Jet Fluxed • Inerted Nitrogen System • One AP Solder tips • PillarCOMM Windows Software • Solder Wire Feeder • Solder Bath Level Sensor • Solder Wave Height Measurement • Black and White Camera Programming • S
Used SMT Equipment | Soldering - Selective
• Process Three Boards At Once “Fluxer, Preheat, Solder Pot” • Jet Fluxer • Bottom Side Preheat, 1 Zone • Dual Pot Lead/Leadfree • Inline • Nitrogen • SMEMA Ready • Wire Solder • 4 X 400V Condition: Complete & Operational “still online” Lo
Industry News | 2003-05-12 09:19:51.0
No larger than conventional 12A wire-to-board connectors for PCB applications
Industry News | 2003-05-02 08:01:53.0
Flexstrip cable jumpers provide multiconductor board-to-board connection without wire stripping, cutting to length or solder preparation.
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Parts & Supplies | Pick and Place/Feeders
KHJ-MC169-02 ROLLER PO 2 YAMAHA feeder part KHJ-MC10W-00 YAMAHA feeder front positioning column YAMAHA feeder accessories KHJ-MC281-00 Electronic feeder handle 12MM-72MM Electric feeder handle Original KHJ-MC181-00 HANDLE SS8mm handle SS electri
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Parts & Supplies | Pick and Place/Feeders
KHJ-MC169-02 ROLLER PO 2 YAMAHA feeder part KHJ-MC10W-00 YAMAHA feeder front positioning column YAMAHA feeder accessories KHJ-MC281-00 Electronic feeder handle 12MM-72MM Electric feeder handle Original KHJ-MC181-00 HANDLE SS8mm handle SS electri
Technical Library | 2023-01-17 17:58:36.0
Heterogeneous integration has become an important performance enabler as high-performance computing (HPC) demands continue to rise. The focus to enable heterogeneous integration scaling is to push interconnect density limit with increased bandwidth and improved power efficiency. Many different advanced packaging architectures have been deployed to increase I/O wire / area density for higher data bandwidth requirements, and to enable more effective die disaggregation. Embedded Multi-die Interconnect Bridge (EMIB) technology is an advanced, cost-effective approach to in-package high density interconnect of heterogeneous chips, providing high density I/O, and controlled electrical interconnect paths between multiple dice in a package. In emerging architectures, it is required to scale down the EMIB die bump pitch in order to further increase the die-to-die (D2D) communication bandwidth. Aa a result, bump pitch scaling poses significant challenges in the plated solder bump reflow process, e.g., bump height / coplanarity control, solder wicking control, and bump void control. It's crucial to ensure a high-quality solder bump reflow process to meet the final product reliability requirements. In this paper, a combined formic acid based fluxless and vacuum assisted reflow process is developed for fine pitch plated solder bumping application. A high-volume production (HVM) ready tool has been developed for this process.
Technical Library | 2019-06-04 10:19:46.0
Interconnection technology relies very heavily on the ability of the conductors on a printed wiring assembly to maintain reliable signal integrity. Harsh environmental factors can precipitate a loss of conductivity due to oxidation and corrosion. Connections are typically soldered or inserted using pressure fitted connectors to obtain enough surface contact to meet the electrical conductivity requirements. In pressure contacts, surface integrity is especially critical where the abrasive effects of retraction and insertion can wear off the metallic finish from the contact area. This can expose the underlying copper or nickel and lead to increased resistance at the contact points. These types of conductors are frequently found in card edge connectors where the terminations are plated with a layer of nickel and gold (frequently referred to as gold fingers). A hard gold is typically used containing very small amounts of nickel and cobalt to increase the wear resistance.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Training Courses | | | IPC J-STD-001 Specialist (CIS)
The Certified IPC J-STD-001 Specialist (CIS) training focuses on the knowledge and hand skills employees need to produce high-quality soldered interconnections.
Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,
Hand Soldering & De-Soldering with Lead-Free Solder - Webinar
Events Calendar | Mon Jan 14 00:00:00 EST 2019 - Mon Jan 14 00:00:00 EST 2019 | ,
Webinar: Crimp Inspection, Quality Control in the Real World of Manufacture
Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control
Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS
Career Center | San Jose, California USA | Engineering,Research and Development
Advanced Packaging Engineer � Develop advanced packaging technologies and processes, including: wafer thinning and dicing; die attach; wire bonding; overmolding; singulation � Perform Design of Experiments to establish optimized process windows for
Career Center | , India | Production
Reads instructions, such as work orders, drawing, and wire lists to determine materials needed and sequence of assembly, Manual Hand tool using for Wire cutting, stripping, crimping. Soldering, Splicing, Assembling PCB Boards, Boot Shrinking, Heat
Career Center | Botevgrad, Sofia Bulgaria | Engineering,Production,Quality Control,Research and Development,Sales/Marketing
AOI - Omron RNS/RNS_ptH, VI3000, Marantz 22X IPC-610D Class 3, Pb/Pb free process, 5S, FMEA, MSA, PPAP, SPC, CPK, 6Sigma, lean manufacturing, Quality management, ISO/TS 16949 ,ISO 9001,ISO 14 001
SMTnet Express, January 16, 2020, Subscribers: 33,604, Companies: 10,962, Users: 25,521 Ultra-Thin Chips For High-Performance Flexible Electronics Credits: Bendable Electronics and Sensing Technologies (BEST) Flexible electronics has significantly
| https://www.eptac.com/ask/soldering-wires-to-pads-with-a-lap-joint/
Soldering Wires to Pads With a Lap Joint - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/soldering
. Making these connections simultaneously also prevents wires disconnecting while soldering the neighboring one. Products Content Sort Order
