New SMT Equipment: soldering to palladium terminations (2)

How to Solder Training Kit

How to Solder Training Kit

New Equipment | Education/Training

This is a "real life" how to solder kit including both throughhole and SMT components. The board has ground planes that you would find in a real PCB assembly. Upon completion the sudents will have a working board. If you are trying to instruct new

BEST Inc.

Board to Board Connectors

New Equipment |  

Wide variety of styles including Peel-A-Way� low profile removable carrier, high density molded connectors, and more. Patented features such as solder preforms and screw-machined terminals offer high reliability.

Advanced Interconnections Corporation

Electronics Forum: soldering to palladium terminations (79)

Poor wetting to palladium

Electronics Forum | Mon Jan 29 12:42:24 EST 2001 | davef

Several points about your query are: * TI�s solderability protection specification is a minimum of 3 u" of palladium over 40-60 u" of nickel plate over a http://www.ti.com/sc/docs/products/logic/package/palladm/index.htm

Poor wetting to palladium

Electronics Forum | Mon Jan 29 06:44:59 EST 2001 | Scott B

I have recently come across a device which has a palladium over nickel finish which when soldered shows evidence of poor wetting to the lead ( i.e. a wetting angle greater than 90�) about three quarters of the way up the side of lead. This is only vi

Industry News: soldering to palladium terminations (74)

MIRTEC to Display the 'World's Most Technologically Advanced' 3D AOI System at Productronica 2023

Industry News | 2023-10-16 12:50:01.0

MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!

MIRTEC Corp

IPC Conference to “Clean Up” Reliability Problems

Industry News | 2013-10-28 16:31:54.0

IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.

Association Connecting Electronics Industries (IPC)

Technical Library: soldering to palladium terminations (8)

Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals

Technical Library | 2015-03-26 19:16:03.0

Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals. The mixed flowing gas test has been demonstrated to produce creep corrosion on parts with nickel-palladium-gold finished terminals. Conformal coats are often used to protect printed wiring assemblies from failure due to moisture and corrosion. However, coating may not be sufficient to protect lead terminations from failure.In this study, acrylic, silicone, urethane, parylene, and atomic layer deposit (ALD) coatings were examined for their effectiveness at preventing corrosion of nickel-palladium-gold-finished terminals.

University of Maryland

The Effects of Plasma Treatment Prior to Conformal Coating

Technical Library | 2021-10-06 17:54:32.0

The corrosion of Nickel-Palladium-Gold (Ni-Pd-Au) finish terminals in humid environments is known to be reduced with the application of a conformal coating such as acrylic. Corrosion has a higher rate of occurrence around the terminal 'knee' of a surface mount component, which may be reduced with the application of conformal coatings. Although radio frequency (RF) plasma processing is generally known to enhance conformity of conformal coating to surfaces through ionic bombardment, the effect on the functionality of assembled printed circuit boards (PCB) is not as well known. The purpose of this study is to assess whether RF plasma processing can enhance the adhesive and coverage qualities of an acrylic conformal coating on PCBs

MARCH Products | Nordson Electronics Solutions

Videos: soldering to palladium terminations (2)

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to 'F' Revisions

Electronics Assembly Standards IPC J-STD-001 and IPC-A-610 Updated to 'F' Revisions

Videos

Teresa Rowe, IPC director of assembly standards, highlights several revisions to IPC J-STD-001F, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610F, Acceptability of Electronic Assemblies. The documents have been updated to

BEST Inc.

BGA Solderability Testing 'Bob Willis How to Do It'

BGA Solderability Testing 'Bob Willis How to Do It'

Videos

Bob Willis "How to Do It" video clip explains how to test BGA or Area Array Packages for solderability. The reason this is difficult to do by other means is the solder terminations would be displaced during solder contact. A simple test like this als

ASKbobwillis.com

Events Calendar: soldering to palladium terminations (1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Express Newsletter: soldering to palladium terminations (982)

SMTnet Express - March 26, 2015

SMTnet Express, March 26, 2015, Subscribers: 22,542, Members: Companies: 14,271 , Users: 37,963 Effectiveness of Conformal Coat to Prevent Corrosion of Nickel-palladium-gold-finished Terminals Michael Osterman; Center for Advanced Life Cycle

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder

Partner Websites: soldering to palladium terminations (118)

Soldering

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/applications/soldering?con=t&page=13

: Soldering FluxJet Precision Drop-Jet Dispenser Nordson SELECT The FluxJet Precision Drop-Jet Flux Dispenser is designed to control and dispense single drops of flux or a continuous flux pattern as

ASYMTEK Products | Nordson Electronics Solutions

5 Soldering Blackfox Courses A la Carte Soldering Series

Blackfox Training Institute, LLC | https://www.blackfox.com/blackfox-courses/operator/a-la-carte-soldering-series/

5 Soldering Blackfox Courses A la Carte Soldering Series Skip to content Phone: (888) 837-9959 | sharonm@blackfox.com Store | Home | EN ES Search for: Course Calendar Course Calendar 2022 IPC Certification Online IPC Training IPC Instructor Online IPC Training IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT

Blackfox Training Institute, LLC


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