7000 N / S Series Automatic Dispensing Robots Robotic Dispensing Systems Description: The application in filling, adhesive, moulding and sealing which need to inject adhesive and sealant. CW Multi-axis system and on line dispens
Applicable Field: Silica gel, EMI conductive adhesive, UV glue, AB glue, fast dry Glue, epoxy adhesive, sealant, hot glue, grease, silver glue, red glue, solder paste, Cooling paste, prevent solder paste, transparent lacquer, screw fixation agent,
Electronics Forum | Tue Dec 16 16:49:22 EST 2008 | scottd3
We ran into this problem before, on all of our models. We never quite found out the reason, we do know that if the PCB is passed through a reflow oven that is extremely dirty with evaporated solder paste flux, it will make it extremely difficult (or
Electronics Forum | Mon May 14 12:44:08 EDT 2012 | tomgervascio
I am a user of an Ersa Versaflow 3/45. I was wondering if anyone could share some process pointers. I have a 0.125" multilayer PCB that I am having problems consistently achieving 75 percent hole fill on a mini-coax connector. The coax connector ha
Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2003-04-17 11:32:31.0
Taking place Sept. 28-Oct. 2, at the Minneapolis Convention Center in Minneapolis, Minn.
Technical Library | 2020-07-15 18:29:34.0
In the early 2000s the first fine-pitch ball grid array devices became popular with designers looking to pack as much horsepower into as small a space as possible. "Smaller is better" became the rule and with that the mechanical drilling world became severely impacted by available drill bit sizes, aspect ratios, and plating methodologies. First of all, the diameter of the drill needed to be in the 0.006" or smaller range due to the reduction of pad size and spacing pitch. Secondly, the aspect ratio (depth to diameter) became limited by drill flute length, positional accuracy, rigidity of the tools (to prevent breakage), and the throwing power of acid copper plating systems. And lastly, the plating needed to close up the hole as much as possible, which led to problems with voiding, incomplete fill, and gas/solution entrapment.
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
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95% on time delivery. Measures daily manufacturing performance versus plan, and work with manufacturing and engineering to determine and communicate corrective actions to maintain on-plan performance. Develops and maintains inventory management sys
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_library-expert-2016-03-released_topic1875.xml
”Updated the pad stack name when the inner layer pad size is different than the outer layersTools > PADS to CAD:When you enter either a part type or a part decal filename, the program will check if the other file is available, and automatically fill in both boxesNow reads free-form text properlyThrough-hole
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. The poor wetting phenomenon usually indicates that the structure of the solder joint is not ideal, including incomplete forming of the IMC and poor solder fill
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