The Texas Engineering Extension Service (TEEX) provides technical training seminars in process technologies for the semiconductor industry. These seminars are delivered on site with a select few offered via open enrollment.
Industry Directory | Manufacturer
Manufacturer of sintering, electrically conductive materials. Applications include semiconductor die attach, component attach, via fill, z-axis interconnection, conductive lines and traces and plated-through hole fill.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Electronics Forum | Mon May 05 11:48:33 EDT 2003 | mk
We have had good luck with via in pads using solid solder deposition. Please contact me off line or provide a number I can call. Thanks Matt Kehoe m.j.kehoe@att.net
Electronics Forum | Thu Jun 10 16:42:11 EDT 2010 | daxman
Hi Muarty, We've had a lot of experience with QFN's now. Several years ago we started testing various design methods of the via arrays as well as paste apertures to cover the arrays. There has been some time that has passed now since these packages
Used SMT Equipment | General Purpose Test & Measurement
The Agilent 1671G offers solid logic analyzer performance at an attractive price. Deep memory options let you capture more data and save you from having to set up complex triggers. The integrated oscilloscope option lets you view analog and digital s
Used SMT Equipment | In-Circuit Testers
Aitelong SAT-17C The Aitelong SAT-17C employs high-speed image processing technology and special positioning technology, allowing the total process of fusion splicing to be finished within 10 seconds. Large-screen LCD clearly demonstrates every s
Industry News | 2003-02-04 08:49:40.0
John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Technical Library | 2016-03-03 17:25:26.0
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results in filled solid copper vias.
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
To see more about the Jade MKII Single Point Selective Soldering System visit Pillarhouse USA at: https://www.pillarhouse.co.uk/products/selective-soldering-handload/jade-mkii-handload Entry-level, single point selective soldering system Designed t
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
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Director of Hardware Engineering & Systems Engineering This is a cutting edge opportunity to bring your current or very recent experience from a leading OEM such as Dell, HP/Compaq, Apple, or other leading PC, Notebook, and Storage and Server manufa
Career Center | Manchester or Novi, Michigan USA | Technical Support
Autodesk, Inc. (NASDAQ: ADSK) is the world leader in 2D and 3D design software for the manufacturing, construction, and media and entertainment markets. Since its introduction of AutoCAD software in 1982, Autodesk has developed the broadest portfolio
Career Center | rawalpindi, Pakistan | Production
Handling the production line including two SWISS pick and place machines cobra and paraquda ,tucano printer reflow oven ,samsung loader and unloader.Hand on experience with 3D camera inspection system and solder paste height measuring instrument and
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HIGHLIGHTS OF QUALIFICATIONS • Over 5 years of experience working as a Technical Support person, Onsite Technician in maintenance and operation of business environment to support business such as inventory of equipments and supplies as well as softw
SMTnet Express, March 3, 2016, Subscribers: 24,124, Companies: 15,000, Users: 40,059 Nanocopper Based Paste for Solid Copper Via Fill David Ciufo, Sujatha Ramanujan, Janet Heyen, Michael Carmody; Intrinsiq Materials , Sunny Patel; Candor
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/call_for_papers.cfm
) Package on Package (PoP) Photonics Photovoltaics and Solar Reliability Silver Wire-bonding Stacked Die System in Package (SiP) Through Silicon Vias (TSVs
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/thermal-relief-for-smd-components_topic1009.html
(?!?), it can certainly make rework difficult with regard to part removal and replacement. Linear Tech encourages the use of solid planes and effectively therefore solder mask defined pads for their BGA and LGA modules
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