Industry Directory | Manufacturer
An innovative thermal management company that is dedicated to address the thermal challenges that the electronics industry is facing.
Industry Directory | Manufacturer
Test fixtures for fine pitch applications to 6 mils center to center spacing.
Introducing the ezCLIP universal stop clip for PCB magazine racks. The ezCLIP system was created to allow electronics manufacturers who manually load/unload PCB magazine racks a simple way to distinguish required spacing between boards and to prevent
FKN Systek K5000 - Manual board feed PCB multiple panel singulation Singulate panels with up to 10 scorelines. Singulate panels with components up to 2.5" 3 models available: - Output tray - Straight output conveyor - Right angle output
Electronics Forum | Wed Nov 07 07:31:20 EST 2001 | steven
what is ideal or minimun spacing in between 2 pads to avoid bridging? thanks
Electronics Forum | Wed Nov 07 11:56:44 EST 2001 | mparker
Pad spacing is just one element to consider. Your pad spacing is determined by the pitch (center to center distance between the leads). There are several good resources to find the appropriate pitch per device. Search the archives here or refer to th
Used SMT Equipment | Pick and Place/Feeders
FUJI sFAB-a (alpha) odd-form inserter Surface mount technology continues to grow as the most popular method for assembling electronic parts, and the quantity of discrete parts used has reduced year by year. However, discrete parts do continue to
Used SMT Equipment | SPI / Solder Paste Inspection
KOH YONG/SPI KY8030 2XL MACHINE KY8030-2XL MC-110-2.5D video observation, image storage, thickness measurement, data recording, background light, laser brightness control, area (square, irregular polygon, circle)/volume/spacing (X, Y axis)/angle
Industry News | 2003-05-30 08:09:11.0
A new compact package integrates a Hall-effect sensor IC with a back-biasing magnet to achieve high airgap performance and meet restrictive space requirement.
Industry News | 2003-02-24 09:32:24.0
Now available with an easy-to-use dispensing gun, Electrolube TCR is a single-component, highly thermally conductive RTV sealant.
Parts & Supplies | SMT Equipment
PCB Separator machine PS2000 Parameters: Max. Separation Width 200 mm PCB thickness 0.5~3 mm Feed rate 200,300,400,500mm/s Blade material Sweden HSS SKH-7 Size 340*340*420 (L*W*H) Power AC220V, 50HZ, 30W Weight 30 kg Feature: The accurate
Parts & Supplies | SMT Equipment
PCB Cutter / Separator machine Specification: Max. Separation Length:300 mm PCB thickness:0.5~3 mm Feed rate:80,120,200,300 mm/s Blade material: HSS steel Weight:27 kg Feature: The accurately adjustable space between the blades is applicabl
Technical Library | 2012-12-17 22:05:22.0
Package on Package (PoP) has become a relatively common component being used in mobile electronics as it allows for saving space in the board layout due to the 3D package layout. To insure device reliability through drop tests and thermal cycling as well as for protecting proprietary programming of the device either one or both interconnect layers are typically underfilled. When underfill is applied to a PoP, or any component for that matter, there is a requirement that the board layout is such that there is room for an underfill reservoir so that the underfill material does not come in contact with surrounding components. The preferred method to dispensing the underfill material is through a jetting process that minimizes the wet out area of the fluid reservoir compared to traditional needle dispensing. To further minimize the wet out area multiple passes are used so that the material required to underfill the component is not dispensed at once requiring a greater wet out area. Dispensing the underfill material in multiple passes is an effective way to reduce the wet out area and decrease the distance that surrounding components can be placed, however, this comes with a process compromise of additional processing time in the underfill dispenser. The purpose of this paper is to provide insight to the inverse relationship that exists between the wet out area of the underfill reservoir and the production time for the underfill process.
Technical Library | 2007-08-16 13:34:31.0
While experienced inspectors may be able to determine the aesthetic differences between a lead-free PCB assembly and a tin-lead version, one cannot rely on the "experienced eye". "Less wetting out to the pad edges" (Figure A) and "graininess and lack of shininess of the solder joint" (Figure B) are typical comments about some lead-free solder joints. However, in cases where a Nitrogen atmosphere was present during the reflow of the solder joint (Figure C), there will be little visual differences between the lead free alloys and their tin-lead counterparts.
Separate precise SMD thin board, aluminum PCB, copper PCB, RF4, fiberglass PCB and T5T8 light. For special board ,needs customization. If you have any question, just feel free to contact e-mail: bella@qy-smt.com or browse Website?https://morel-equi
Separate precise SMD thin board, aluminum PCB, copper PCB, RF4, fiberglass PCB and T5T8 light. For special board ,needs customization. If you have any question, just feel free to contact e-mail: bella@qy-smt.com or browse Website?https://morel-equi
Training Courses | | | IPC-7711/7721 Trainer (CIT)
The Certified IPC-7711/7721 Trainer (CIT) courses recognize individuals as qualified trainers in the area of rework and repair of printed boards and electronic assemblies and prepares them to deliver Certified IPC-7711/7721 (CIS) training.
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,
Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Rosemont, Illinois USA | Management,Production,Quality Control,Research and Development
For Philips, improving lives with light goes back to our founding fathers in 1891. At Philips Lighting, we carry this tradition forward, across all three domains: Healthcare, Lifestyle and Technology. Through a huge array of products, and variety in
Career Center | Toronto, Ontario Canada | Production,Quality Control,Technical Support
HIGHLIGHTS OF QUALIFICATIONS • Over 5 years of experience working as a Technical Support person, Onsite Technician in maintenance and operation of business environment to support business such as inventory of equipments and supplies as well as softw
Career Center | Wesley Chapel, Florida USA | Engineering,Management,Quality Control
15 years of experience on Electronic Manufacturing. Certified SMT Process Engineer TQM Knowledge Statistics DOE Screen Printer Thermal Process Knowledge JIT International Project Engineering Experience
Blackfox Training Institute, LLC | https://www.blackfox.com/whats-the-difference-between-th-and-smt-soldering/
What's the Difference Between TH and SMT Soldering? - Blackfox Skip to content Blackfox Premier Training & Certification +1 (888) 837-9959 Search: Course Calendar Course Calendar 2024 IPC Certification IPC Courses IPC-A-600 IPC 7711/7721 IPC-A-6012 IPC 7711/7721 Recert IPC-A-610 IPC/WHMA-A-620 IPC-A-610 Recert IPC/WHMA-A-620 Recert J-STD-001
| https://www.eptac.com/blog/nasas-adoption-of-j-std-001-space-addendums
NASA’s Adoption of J-STD-001 Space Addendums Looking for solder training standards, manuals, kits, and more? Visit soldertraining.com Training Training Materials Locations Resources Ask Helena
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