618 speedline econopack 11 6/f 1989 results

Express Newsletter: speedline econopack 11 6/f 1989 (587)

SMTnet Express - Octomer 22, 2020

SMTnet Express, Octomer 22, 2020, Subscribers: 28,093 , Companies: 11,152, Users: 26,187 Realization of a New Concept for Power Chip Embedding Credits: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Embedded components

Partner Websites: speedline econopack 11 6/f 1989 (31)

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

) 1 190 190 9 200 200 2 200 200 10 200 200 3 200 200 11 200 200 4 200 200 12 240 240 5 200 200 13 255 255 6 200 200 14 265 265 7 200 200 15 265 265 8 200 200 To be published in the Proceedings of SMTA

Heller 公司

Vacuum Reflow Processing On Solder Joint Voiding

Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf

) 1 190 190 9 200 200 2 200 200 10 200 200 3 200 200 11 200 200 4 200 200 12 240 240 5 200 200 13 255 255 6 200 200 14 265 265 7 200 200 15 265 265 8 200 200 To be published in the Proceedings of SMTA

Heller Industries Inc.


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