Industry Directory | Manufacturer
Supplier of Optical Based Inspection and Measurement Equipment.
Industry Directory | Manufacturer
VisionMaster is the original longtime manufacturer of advanced yet affordable 3-D solder paste inspection (SPI) equipment. VisionMaster provides best-in-class 3D white light technology and repeatability at laser technology prices.
JUKI Visual Inspection Machine AOI/SPI RV-2 Frame size:750mm x 750mm Board size:610mm x 510mm Dimension:W1,310mm x D1,470mm x H1,530mm weight:1,000kg Product description: JUKI Visual Inspection Machine AOI/SPI RV-2 INQUIRY juki Visua
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
Used SMT Equipment | Pick and Place/Feeders
MS-11e 3D SPI Series Specifications Feel free to contact me for more details!!! Email: Daisy.Zhang@qy-smt.com Standard Features: Intel® Multi-Core PC, 32” Flat Screen LCD Monitor, Windows 10TM OS, HDD, Mouse & Keyboard, Network LAN Card.Single Stag
Used SMT Equipment | SPI / Solder Paste Inspection
Make: Koh Young Model: 8030-3L Vintage: 2011 Details: • Windows XP Operating System • 3D • 4M Pixel High Speed Camera • Automatic Conveyor Width Adjustment • Front/Rear Fixed Conveyor • SPC Plu
Industry News | 2011-04-20 15:15:58.0
Christopher Associates Inc. today announced that it has been appointed as the North American distributor for the Intek Plus SPI Series of solder paste inspection systems.
Industry News | 2012-10-10 17:45:02.0
ASC International, have entered into an agreement that will focus on sales and service of SAKI’s 2D & 3D AOI and X-ray product line in the North American market.
Technical Library | 2015-04-29 03:48:39.0
SPI equipment is routinely used in Printed Circuit Board (PCB) manufacturing to monitor and control one of the most crucial steps affecting the finished quality of circuit board. Solder paste deposition is the key process in board assembly operations using SMT techniques. Our LSM™ system was the industry's first popular method of manually inspecting solder paste; our SE systems revolutionized SMT production by offering an automated method for performing in-process 3D inspection on the assembly line. SPI systems measure the height and volume of the solder pads before the components are applied and the solder melted, and when used properly, can reduce the incidence of solder-related defects to statistically insignificant amounts. Critical to the SPI measurement is the accuracy of the height measurement because that has a direct correlation with solder volume and defects.
SMT Label Mounter ETA-310 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. SMT Label Mounter,Online SMT Label Mounter,PCB Board Automatic L
SMT Label Mounter ETA-310 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. SMT Label Mounter,Online SMT Label Mounter,PCB Board Automatic L
Career Center | Rochester, New York USA | Engineering,Production,Sales/Marketing,Technical Support
Working Experience: Fairchild Semiconductor, South Portland, ME Package Simulation Co-op: Technology CAD Group (Mar.2002-Present) Thermal simulation for 40 lead fine pitch QSOP & 48 lead one die fine pitch QSOP: Created a 3D model
