New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printing
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
Electronics Forum | Wed Feb 03 11:31:20 EST 2016 | steprog
Hi, New to this forum. I am an engineer assigned to resolve a quality issue on our production line. It seems that we have been getting small droplets of flux on our boards after the reflow process. Occasionally, they land on a board to board conne
Electronics Forum | Thu Jul 26 09:47:30 EDT 2018 | vchauhan
Rob, Thank you so much for your suggestions. Vinod.
Industry News | 2011-09-14 12:04:43.0
The SMTA announced a session on QFN Assembly and Reliability will take place on Tuesday, October 18 during their annual conference, SMTA International, in Ft. Worth, Texas. Andrew Mawer of Freescale Semiconductor will chair the session and Viswam Puligandla, Ph.D., Nokia (Retired) will co-chair.
Industry News | 2016-09-15 18:08:04.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, Illinois. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.
Technical Library | 2017-08-17 12:28:30.0
At SMT assembly, flux outgassing/drying is difficult for devices with poor venting channel, and resulted in insufficiently dried/burnt-off flux residue for no-clean process. Examples including: Large low stand-off components such as QFN, LGA Components covered under electromagnetic shield which has either no or few venting holes Components assembled within cavity of board Any other devices with small open space around solder joints
Technical Library | 2024-07-24 01:18:03.0
Quad Flat No-Lead (QFN) packages has become very popular in the industry and are widely used in many products. These packages have different size and pin counts, but they have a common feature: thermal pad at the bottom of device. The thermal pad of the leadless QFN provides efficient heat dissipation from the component to PCB. In many cases, arrays of the thermal via under the component is used to dissipate heat from the device. However, thermal vias can create more voids or result in solder protrusion onto the secondary side.
LISA SPIDER robot pick and place machine 2D/3D vision components copanarity check Tape & reel for tape OUT process Tray stacker for Tray IN proce/OUT process Tape IN feeder Anyfeeder for loose component sorting More under www.aatec.ch
BEST manufactures and designs SMT stencils-both metal and plastic film type. This video demonstrates our metal stencil laser. See more on stencils here: http://www.soldertools.net/categories/Metal-Stencils/
Events Calendar | Tue Mar 07 08:00:00 EST 2017 - Tue Mar 07 14:00:00 EST 2017 | Rolling Meadows, Illinois USA
Rework Symposium
Events Calendar | Wed May 10 00:00:00 EDT 2017 - Wed May 10 00:00:00 EDT 2017 | Itasca, Illinois USA
Kester to Host Technical Rework Seminar
Career Center | Fremont, California USA | Engineering,Production
4 years of PCB assembly process.
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
The Effect of Coating and Potting on the Reliability of QFN Devices. Online Version SMTnet Express, August 28, 2014, Subscribers: 23150, Members: Companies: 14012, Users: 36727 The Effect of Coating and Potting on the Reliability of QFN Devices
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4798
. Many of the industry standard test vehicles are dated and not representative of current electrical and electronic assemblies. The purpose of this research is to use a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
) of the system while still achieving the void rate reduction < 1%. Another key capability that will be explored is the elimination of solder splatter during the process of vacuum purge down
