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Electronics Forum | Thu Mar 04 12:49:49 EST 1999 | SMTASSY
| Are square pads more difficult to wavesolder than round pads? | I am referring to a through hole board. | Usualy square pads are for indication of pin 1 on a DIP for example. There might be a difference in the capilary affect due to a different su
Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
Used SMT Equipment | Screen Printers
MPM APB HiE 2d vision Understencil Cleaner Fine Pitch Year 2000 *Print Area: 2” x 2” to 18” x 16” *Board Size: 2” x 2” to 20” x 16” *Stencil Frame Size: 29" x 29" *Vision Specifications: Viewing Capability: 17.5” x 16” Field o
Industry News | 2018-10-18 08:43:30.0
Pin-in-Paste Reflow Calculations and Special Cases
Industry News | 2015-06-02 13:26:13.0
Japan Unix introduces laser shape rings. Choosing the best laser spot shape to fit components and land shapes can reduce circuit board problems.
SMT Express, Issue No. 3 - from SMTnet.com Volume 1, Issue No. 3 Wednesday, August 18, 1999 Featured Article Return to Front Page BGA REWORK Earl Moon Proof Of Design (POD) COMPARE PART SQUARENESS TO BOARD'S SILK-SCREEN OR TRACES A part
ORION Industries | http://orionindustries.com/steel-rule-die.php
. Key points to consider are highlighted below: Allow a radius on all corners: A radius of 1 mm or less creates a corner in the steel rule die which is stronger than a square corner
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-touching-glass-body-components-like-diodes
. The situation at times is that the solder does touch the bottom of the glass component due to the pad or land size and the orientation of those pads due to the design of the product and the position
