Industry Directory | Manufacturer
XPCB is a PCB manufacturer with superior expertise in multilayer rigid-flex PCB and flex PCB, supporting special technology including VIPPO, stacked vias, buried vias, blind vias, unsymmetrical structure, and air gap structure.
Industry Directory | Distributor / Equipment Dealer / Broker / Auctions
When you are in the market for NSN, aviation, and electronic parts, utilize a premier purchasing platform such as Stacked NSN to secure all your requirements with unmatched pricing and rapid lead-times.
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
New Equipment | Board Handling - Conveyors
product instruction ※ Stable and reliable integrated control system ※ Easy to operate touch LED buttons or touch screen control interface ※Machine always fault monitoring ※ optional pass working mode ※ Smooth and parallel width adjustment (
Used SMT Equipment | Flexible Mounters
Product Name: Samsung CP40L multi-function chip mounter Product number: CP40L Detailed product introduction Samsung CP40L multi-function chip mounter Mounting head: 3 On the way: linear laser (Ji Guangtou) Substrate size: 460*400*4.2mm Min:50*
Used SMT Equipment | SMT Equipment
Product Name: Samsung CP40L multi-function chip mounter Product number: CP40L Detailed product introduction Samsung CP40L multi-function chip mounter Mounting head: 3 On the way: linear laser (Ji Guangtou) Substrate size: 460*400*4.2mm Min:50*
Industry News | 2019-12-09 14:44:26.0
The SMT Reflow Soldering Equipment (Global) award was awarded to Heller Industries by Frost & Sullivan.
Industry News | 2003-05-30 08:26:20.0
The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.
Technical Library | 2025-08-29 13:53:05.0
In electronics manufacturing, "underfill" refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit. It is also important in 3D ICs and advanced packaging technologies that involve stacking multiple chips or integrating multiple functions into a single package.
Technical Library | 2011-01-20 18:43:39.0
PCB stack-up is an important factor in determining the EMC performance of a product. A good stack-up can be very effective in reducing radiation from the loops on the PCB (differential-mode emission), as well as the cables attached to the board (common-mo
This video describes the BEST BGA rework and BGA rework services capabilities. What is described in this movie are the people, processes and tools unique to BEST and how that impacts its customers. The advanced equipment set including multiple refl
About more detail for the PCB destacker check the link? https://www.ascen.ltd/Products/Automatic_SMT_equipment/PCB_loader/125.html PCB destacker/PCB bare board unloader unloading bare board to replace the PCB magazine unloader machine for the PCB bar
Training Courses | | | PCB Design Courses
The PCB design courses teach students the process, techniques and tools needed to design layout of printed circuit boards.
Events Calendar | Sun Jun 09 18:30:00 UTC 2024 - Sun Jun 09 18:30:00 UTC 2024 | Carlsbad, California USA
San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA
Events Calendar | Mon Jul 10 18:30:00 UTC 2023 - Mon Jul 10 18:30:00 UTC 2023 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Career Center | St. Louis, Missouri USA | Production
A growing Tier 1 Automotive Supplier is seeking a 2nd shift (3:45pm to 12:15am) Electronics Test Technician to join their team! Candidate must have 3 to 5 years of practical manufacturing experience with electronics test systems. Must have experie
Career Center | Fremont, California USA | Engineering
Job Description: • Has full ownership of HW design and release including HW specification creation, schematic generation, PCB layout, board bring up, and design verification. • Complete PCB design schematic using Orcad capture. • Complete HW desig
Career Center | Erode, Tamilnadu India | Engineering
Professional Summary 3+ years of experience in the PCB CAM engineering Exposure to FRONTLINE GENESIS 2000 Having exposure in UCAM Exposure to Create, Array & Panelize it for manufacturability Experienced in Creating impedance cou
Career Center | , Abu Dhabi | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
SMTnet Express, May 14, 2015, Subscribers: 22,738, Members: Companies: 14,345 , Users: 38,183 Reliability of Stacked Microvia Hardeep Heer, Ryan Wong; Firan Technology Group The Printed Circuit Board industry has seen a steady reduction in pitch
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/markets-and-industries/3d-packaging-and-wafer-level-packaging
& Wafer-Level Packaging Dispensing applications for stacked dies with through silicon vias (TSV) and face-to-face stacked dies 3D packages are emerging in the semiconductor packaging industry to address the serious technical challenges such as miniaturization, faster interconnections, power
| http://etasmt.com/cc?pageID=newsList&ID=te_news_news,0&pNum=8
part then transfers PCBs stacked in a magazine rack to the downstr... Show Details Magazine Loader - Single Located at the first stage of SMT line, this unit transfers PCBs stacked in a magazine rack to the downstream machine using a pneumatic pusher one by one. It supplies mag
