New Equipment | Rework & Repair Equipment
Protecting Heat Sensitive Components. Are you in need of a flexible method for shielding nearby components during the PCB rework process? Do you find yourself looking for an effective heat shielding product which can be easily modified to protect a
New Equipment | Education/Training
IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a c
Electronics Forum | Fri Nov 04 12:12:36 EDT 2016 | defakto227
It doesn't appear that the Bostik material has a UL listing.
Electronics Forum | Wed Nov 02 19:00:10 EDT 2016 | rdubya71
look at bostik 7538
Industry News | 2019-09-13 07:56:55.0
Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.
Industry News | 2010-04-10 02:07:54.0
IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.
Parts & Supplies | Pick and Place/Feeders
Email: wendy@leadersmt.com +86 13148795469 http://www.leadersmt.com
Parts & Supplies | Pick and Place/Feeders
Email: wendy@leadersmt.com +86 13148795469 http://www.leadersmt.com
Technical Library | 2023-08-16 18:48:50.0
One of our aerospace customers was looking to automate a few manual operations and asked for suggestions. This customer specializes in assemblies for inflight connectivity for commercial airlines and low orbit satellites. The dispensing process included the application of bonding to the sides of large and small components (4-axis) and the ability to cope with the changing viscosity during processing. The material used was EC-2216 B/A Two Part Epoxy and the largest board size was 12"x10"
Technical Library | 2016-11-17 14:58:02.0
Since 2006 RoHS requirements have required lead free solders to take the place of tin-lead solders in electronics. The problem is that in some environments the lead free solders are less reliable than the older tin-lead solders. One of the ways to solve this problem is to corner stake, edge bond or underfill the components. When considering what mitigation technique and material to use, the operating conditions must be characterized. The temperature range is important when selecting a material to use since the glass transition temperature (Tg) and coefficient of thermal expansion (CTE) are important properties. If improperly chosen, the mitigation material can cause more failures than an unmitigated component.
https://www.ascen.ltd/Products/Component_lead_forming_machine/ Motorized version ASCEN taped component axial lead forming machine AS-809F axial lead former, use for cut and bend axial components braid resistor,capacitor, inductor, diode and other ele
https://www.ascen.ltd/component_tape_feeder/ Robotic component axial tape feeder for robot that use to cuts and bends taped axial components,and then holds the component so that the robot can pick them up online or link to the SMT insertion machine f
Training Courses | ON DEMAND | | IPC J-STD-001 Trainer (CIT)
The Certified IPC J-STD-001 Trainer (CIT) courses prepare individuals as qualified trainers in the area of producing high quality soldered interconnections and prepares them to deliver Certified IPC J-STD-001 Specialist (CIS) training.
SMTnet Express, May 21, 2015, Subscribers: 22,770, Members: Companies: 14,358, Users: 38,224 Reliability of Embedded Planar Capacitors under Temperature and Voltage Stress Mohammed A. Alam, Michael H. Azarian, Michael Osterman and Michael Pecht
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/thermal-interface-material-tim?con=t&page=3
) These products are recommended for thermal interface applications Products Content Your results for: Thermal Interface Material (TIM) DV-8000 Heli Flow Pump Nordson ASYMTEK Nordson ASYMTEK Introduces Helios Automated Fluid Dispensing Platform for Medium and Bulk Volume Deposits Nordson ASYMTEK Dispenses both single- and two
ASCEN Technology | https://www.ascen.ltd/Blog/machine/Componnent_preforming_cutting/947.html
insertion component types and stick formats Customized steps, please tell us following question: 1.Provide the physical picture for the material and the material size and then to quote. 2
