Industry Directory | Other / Manufacturer
Gen Pack Assembly is a contract electronics manufacturer providing PCB assembly, testing, and box-build integration for your mid volume & high mix productions. A trusted partner for over 25 years, Gen Pack is proudly ISO:9001
Industry Directory | Consultant / Service Provider
PCB assembly services, both US and offshore. We handle basic through-hole to standard surface mount to ultra-fine pitch. Quote and order PCB fabrication and assembly online.
Flason SMT Automatic SMT 1200mm Solder paste printer for SMT assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Automatic1200mm SMT Solder paste p
Flason SMT Second hand Automatic1200mm Solder paste printer for SMT assembly line Power Supply: AC:220±10%,50/60HZ Control Method: PC Control PCB Size/Max:1200*340mm Weight Approx:1500Kg Product description: Second hand Automatic1200mm
Used SMT Equipment | General Purpose Equipment
FEATHERS The solder paste miser efficiently and evenly mixes the solder paste to a liquid state. It helps to achieve better results of stencil printing and reflowing processes. The use of the mixer also reduces the chances of absorbing air moistur
Used SMT Equipment | Pick and Place/Feeders
=1.0 ±50/Chip Cpk>=1.0 ±35/QFP Cpk>=1.0 ±50/Chip Cpk >=1.0 ±35/QFP Cpk >=1.0 Productive Highest Tact (CPH/sec) 25,000/0.144 19,000/0.189 7,200/0.5 Effectiveness Tact (CPH/sec) 17,000/0.21 14,000/0.26 5,000/0.72 PCB trans
Industry News | 2024-04-06 00:43:25.0
Live demos at IPC APEX Expo 2024 – Booth 1504 – April 9-11, 2024, Anaheim, CA GRAND JUNCTION, CO USA -- April 2024 -- GPD Global – manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix, and R&D production – will exhibit in Booth 1504 at IPC APEX EXPO 2024 on April 9-11 in the Anaheim Convention Center, CA.
Industry News | 2017-04-11 21:19:32.0
GPD Global offers versatile large format inline dispensing systems and stand-alone liquid dispense technologies for maximizing product yield. This is the largest standard PCB dispensing system platform in the industry.
Technical Library | 2015-11-19 18:15:07.0
The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder balls. The reliability of these devices is not well established when assembled using a standard tin-lead (SnPb) solder paste and reflow profile, known as a backward compatible process. Previous studies in processing mixed alloy solder joints have demonstrated the importance of using a reflow temperature high enough to achieve complete mixing of the SnPb solder paste with the Pb-free solder ball. Research has indicated that complete mixing can occur below the melting point of the Pb-free alloy and is dependent on a number of factors including solder ball composition, solder ball to solder paste ratio, and peak reflow times and temperatures. Increasing the lead content in the system enables full mixing of the solder joint with a reduced peak reflow temperature, however, previous research is conflicting regarding the effect that lead percentage has on solder joint reliability in this mixed alloy solder joint.
Technical Library | 2022-10-31 17:30:40.0
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive, but non-exhaustive, collection of thermal cycling test results. The assembled database covers life test results under multiple test conditions and for a variety of components: conventional SMT (LCCCs, resistors), Ball Grid Arrays, Chip Scale Packages (CSPs), wafer-level CSPs, and flip-chip assemblies with and without underfill. First-order life correlations are developed for SAC assemblies under thermal cycling conditions. The results of this analysis are put in perspective with the correlation of life test results for SnPb control assemblies. Fatigue life correlations show different slopes for SAC versus SnPb assemblies, suggesting opposite reliability trends under low or high stress conditions. The paper also presents an analysis of the effect of Pb contamination and board finish on lead-free solder joint reliability. Last, test data are presented to compare the life of mixed solder assemblies to that of standard SnPb assemblies for a wide variety of area-array components. The trend analysis compares the life of area-array assemblies with: 1) SAC balls and SAC or SnPb paste; 2) SnPb balls assembled with SAC or SnPb paste.
Features▶Use self-developed control software▶ More precise control of temperature and speed▶Temperature and speed curve display▶No counterweight, faster to use▶Super silent▶Use original accessories The solder paste mixer can effectively mix the tin p
Features▶Use self-developed control software▶ More precise control of temperature and speed▶Temperature and speed curve display▶No counterweight, faster to use▶Super silent▶Use original accessories The solder paste mixer can effectively mix the tin p
Training Courses | ONLINE | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
Career Center | Puducheery, Tamil nadu India | Production
________________________________________V. KIRUBAKARAN SMT Production Engineer Mobile: +918925842383 | E-Mail: gvkirubakaran@gmail.com Passport Number: M6034648 | Issued date: 05 February 2015 | Expiry date: 05 February 2015 ___________________
SMTnet Express, November 19, 2015, Subscribers: 23,763, Members: Companies: 14,760, Users: 39,366 HALT Testing of Backward Soldered BGAs on a Military Product B. Gumpert, B. Fox, L. Woody; Lockheed Martin Corporation The move to lead free (Pb
SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing SMT Line Improvements for High Mix, Low Volume Electronics Manufacturing This work covers two major projects aimed at increasing quality and efficiency on a high mix, low
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5108
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