New SMT Equipment: standoff height calculation (21)

Precision Lead Former for Axial Components (CF-8)

Precision Lead Former for Axial Components (CF-8)

New Equipment | Lead Forming

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

Lead Former for Bulk or Loose RADIAL Components (CF-10)

Lead Former for Bulk or Loose RADIAL Components (CF-10)

New Equipment | Lead Forming

Form & Cut 2-, 3-, 4-, 5-, and 7-leaded Radial Components Capable of forming loose radial components at rates up to 5,000 parts per hour with a variable speed motor. Feed components by hand or with tubes (TO-220s) Reduce setup time with quick ch

GPD Global

Electronics Forum: standoff height calculation (116)

SMD solder joint calculation

Electronics Forum | Wed Jan 16 15:22:29 EST 2002 | Terry Burnette

In his book titled "Manufacturing Techniques for Surface Mount Assemblies" author R.J. Klein Wassink describes the relationship between solder land dimensions, component lead coplanarity, board warpage, solder volumes, and solder paste flux wetting b

Solder height after reflow

Electronics Forum | Thu Dec 09 07:21:10 EST 2010 | scottp

You won't have 2 mil height because the solder doesn't remain brick shaped. It's a dome. In the past I tried doing some calculations using the formula for the volume of a spherical section and also tried using a simulation program that accounts for

Used SMT Equipment: standoff height calculation (25)

Q-Corp Series 2000 Q2G

Q-Corp Series 2000 Q2G

Used SMT Equipment | THT Equipment

Very nice Q Corporation Lead Trimmer Cutter For Sale! See attached pictures and information below. Equipment Description •Q Corporation 2000 Series Q2G lead trimmer •Brushless DC drive for low maintenance with dynamic braking •Variable

1st Place Machinery Inc.

Panasert PEMTRON SPI TROI-7700HD

Panasert PEMTRON SPI TROI-7700HD

Used SMT Equipment | Pick and Place/Feeders

PEMTRON SPI TROI-7700HD    Technology & Features:   Dual Projection Combination of 2D & 3D inspection eliminates common shadow problem with SPI systems. 64 bit Windows 7 Operation System Fast & Stable Operating System for high density PCB.

Qinyi Electronics Co.,Ltd

Industry News: standoff height calculation (54)

SMTA Capital Chapter to Host a FREE Webinar November 13th on "Accelerating Continuous Improvement with Next Generation pH Neutral Cleaning Products"

Industry News | 2020-11-06 17:48:48.0

The SMTA Capital Chapter is excited to host another FREE webinar on Friday, November 13th. The webinar will include an informative presentation given by industry expert Ravi Parthasarathy of ZESTRON Corporation on "Accelerating Continuous Improvement with Next Generation pH Neutral Cleaning Products."

Surface Mount Technology Association (SMTA)

Ball Grid Array Inspection

Industry News | 2018-10-18 09:58:15.0

Ball Grid Array Inspection

Flason Electronic Co.,limited

Parts & Supplies: standoff height calculation (5)

Juki Compatible Magnetic Standoff Pin for FX3 Adjustable Height

Juki Compatible Magnetic Standoff Pin for FX3 Adjustable Height

Parts & Supplies | Pick and Place/Feeders

JUKI 750/760  X motor   TS4513N1820E200      200V 600W  E9611721000 JUKI 750/760 Y motor     TS4514N1827E200      200V 800W   JUKI 2050/2060 X motor   TS4613N1020E200      600W    JUKI 2050/2060 Y motor   TS4616N1020E200      1140W    JUKI 2050/2

Qinyi Electronics Co.,Ltd

Fuji High Speed Surface Mount Placement Machine Fuji Scalable Placement Platform NXT Ⅲ

Fuji High Speed Surface Mount Placement Machine Fuji Scalable Placement Platform NXT Ⅲ

Parts & Supplies | Pick and Place/Feeders

Brand: FUJI Name: FUJI Scalble Placement Platform NXT Iii Module Width: 320mm Placing Accuracy: +/-0.038 (+/-0.050) Mm (3σ) Cpk≥1.00* Lntelligent Feeders: Support For 4, 8, 12, 16, 24, 32, 44, 56, 72, 88, And 104 Mm Wide Tape Part Size: 04

KingFei SMT Tech

Technical Library: standoff height calculation (3)

Lead-free Rework Process For Chip Scale Packages

Technical Library | 2007-03-28 10:18:33.0

Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Packages (CSPs) is the relatively high temperatures that the components and the boards experience. Fine-pitch CSPs have very low standoff heights following assembly making inspection and rework of these components more difficult. One other concern pertinent to rework is the temperature of the neighboring components during rework. These issues, coupled with the limitations of rework equipment to handle lead-free reflow temperatures, make the task of reworking lead-free assemblies more challenging.

Universal Instruments Corporation

Common Process Defect Identification of QFN Packages

Technical Library | 2019-07-23 22:33:47.0

The Quad Flat Pack No Leads (QFN) style of leadless packaging [also known as a Land Grid Array (LGA)] is rapidly increasing in us e for wireless, automotive, telecom and many other areas becaus e of its low cost, low stand-off height and excellent thermal and electri cal properties. With the implementation of any new package type, there is always a learning curve for its use in design and processing as well as for the Process and Quality Engineers who have to get to grips with the challenges that these packages bring. Therefore, this paper will provide examples of the common process defects that can be seen with QFNs /LGAs when using optical and x-ray inspection as part of manufacturing quality control. Results of trials conducted on four PCB finishes and using vapour phase and convection reflow will be discussed.

Nordson DAGE

Videos: standoff height calculation (20)

Precision Lead Former for Axial Components (CF8)

Precision Lead Former for Axial Components (CF8)

Videos

Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s

GPD Global

PCB Footprint Expert

PCB Footprint Expert

Videos

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

Career Center - Resumes: standoff height calculation (3)

Ronald_resume_technician

Career Center | Laguna, Calabarzon Philippines | Engineering,Maintenance,Production,Technical Support

Base on my experience more on line sustaining and preventive maintenance in equipment and testing machine for electronics and semicon company Some slight skills in surface grinding,soldering and LAN connection and installation. Can submit report

NPI Engineer

Career Center | Theni, Tamilnadu India | Engineering

NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu

Express Newsletter: standoff height calculation (195)

Partner Websites: standoff height calculation (201)

JUKI Compatible Magnetic Standoff Pin for FX3 Adjustable Height QY202212060002 QYSMT

Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/qy202212060002-compatible-magnetic-standoff-pin-for-fx3-adjustable-height-228921?page=33&order=list_price+asc

JUKI Compatible Magnetic Standoff Pin for FX3 Adjustable Height QY202212060002 QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products Compatible Magnetic Standoff Pin for FX3 Adjustable Height

Qinyi Electronics Co.,Ltd

Nordson DAGE Announces the Introduction of a New Method for Testing Thin Die

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-announces-the-introduction-of-a-new-method-for-testing-thin-die

. Cantilever bend utilizes the shear action and precision controlled step back capability of the 4000Plus combined with special fixturing and software to bend the die at a fixed height (the loading height

ASYMTEK Products | Nordson Electronics Solutions


standoff height calculation searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next