Power Supply Control from PCB to Chip Core Power Supply Control from PCB to Chip Core As silicon technology advances to enable higher density ASICs, the core logic voltage decreases. The lower voltage, in combination with higher current
SMTnet Express March 7, 2013, Subscribers: 26214, Members: Companies: 13311, Users: 34412 PTH Core-to-Core Interconnect Using Sintered Conductive Pastes The market for high-layer-count printed circuit boards (PCB) containing blind and buried vias
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don’t want to be liable for failures in the field due to old material. As for the cored wire solder, similar storage issues apply, but more to the point, the real concern is the changing activity of the flux in the core due to its corrosive or acidity properties working
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) Apply flux cored solder on the oxidized tip. Once the flux is activated it starts a chemical reaction that removes the oxidation. Clean the tip with a brass wool or automatic tip cleaners Repeat the steps above until the tip is visibly clean If the tip is still not clean after this process, move on to the next step