New Equipment | Test Equipment
Meets ANSI-J-STD002, ANSI-J-STD003, JEDEC JESD22-B102D, MIL-STD-202, IEC-68-2-54. Complete monitoring and control of steam or water temperature. Features include: Automatic timing of the test duration, digital indicator for elapsed time and cycle tim
Lead Tinning is an important aspect when components need to withstand adverse conditions for extended periods. Lead Tinning can also be used in the restoration of corroded components to their original condition. V-TEK meets or exceeds Mil standards.
Electronics Forum | Thu Feb 22 12:47:30 EST 2001 | Todd Beninghaus
I work for a medium sized electronic manfacturing company that is looking into potentially purchasing our own piece of steam aging equipment, but I am having trouble locating manufacturers. So far I have only found H&H Engineering in Stockton, CA. D
Electronics Forum | Fri Feb 23 11:32:17 EST 2001 | toddbe
Davd, Thats what first came to my mind when I was asked to do this task, the old train belching out climbing the last hill towards town ;) H&H Engineering has what used to be Mountain Gate's line of steam aging equipment. They are at 209-475-0693
Industry News | 2021-12-06 15:28:38.0
Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.
Industry News | 2021-05-18 14:19:48.0
Photon steam aging system provides accelerated life testing simulating elongated storage conditions for high reliability applications.
Technical Library | 2020-11-15 21:01:24.0
ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new surface finish also for enhancing and preserving solder-ability but with the advantage of eliminating Electroless Nickel from the deposit layer. This feature has become increasingly important with the increasing use of high frequeny PWB designs whereby nickel's magnetic properties are detrimental. We examine these two finishes and their respective soldering characteristics as plated and after steam aging and offer an explanation for the performance deviation.
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
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