Electronics Forum | Fri Nov 20 00:14:23 EST 2015 | ttheis
To clarify- what I have is: 1. Manual stencil print process 2. Dynapace conveyor into GSM 3. Dynapace conveyor out of GSM into oven So what I need is a way to tell the conveyor into the placement machine to "go" when a board is loaded onto it after
Electronics Forum | Thu Jul 22 12:50:04 EDT 1999 | Jennifer
I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. Just out of curiosity, who's holding the market for the semi-automatic screen printers these days aside from Transition Automation? I know MPM offers
Industry News | 2003-01-31 09:39:08.0
Expected to be Below the Guidance Provided During the Company's Earnings Conference Call on December 18, 2002
Industry News | 2018-10-18 09:46:58.0
Analysis of how to spot welding process
Technical Library | 2014-12-24 19:22:52.0
For centuries, the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates, from cloth material to electronic circuit boards. One area of blade printing mechanics that have been reviewed many times is the angle of attack of the blade. Typically it has been tested from 45 degrees to 60 degrees to optimize the printing quality and efficiency. However, this typically ends up as a compromise, from fill characteristics (45 degrees) to print definition (60 degrees). This paper will present the revolutionary performance of the profiled squeegee blade, which has recently been developed to create a virtual multi angle of attack for unsurpassed process control for all types of stencil printing processes.
Technical Library | 2015-12-31 15:19:28.0
Today's consumer electronic product are characterized by miniatuization, portability and light weight with high performance, especially for 3G mobile products. In the future more fine pitch CSPs (0.4mm) component will be required. However, the product reliability has been a big challenge with the fine pitch CSP. Firstly, the fine pitch CSPs are with smaller solder balls of 0.25mm diameter or even smaller. The small solder ball and pad size do weaken the solder connection and the adhesion of the pad and substrate, thus the pad will peel off easily from the PCB substrate. In addition, miniature solder joint reduce the strength during mechanical vibration, thermal shock, fatigue failure, etc. Secondly, applying sufficient solder paste evenly on the small pad of the CSP is difficult because stencil opening is only 0.25mm or less. This issue can be solved using the high end type of stencil such as Electroforming which will increase the cost.
Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
| https://www.smtfactory.com/How-to-clean-the-bottom-of-a-Full-auto-SMT-Stencil-Printer-stencil-automatically-online-id3873969.html
How to clean the bottom of a Full-auto SMT Stencil Printer stencil automatically online? - Dongguan Intercontinental Technology Co.,Ltd. English Türk dili Tiếng Việt 한국어 日本語
| https://productronica.com/en/program/live-demonstrations/drones-in-logistics/
. The reason stems from huge advances in electronics and falling costs due to large volumes, fuelled by the commercial success and proliferation of smartphones since the end of the last decade
winsouce.jpg)