Industry Directory | Consultant / Service Provider / Manufacturer
Tropical Stencil is dedicated to providing the highest quality Laser Cut Stencils; with our rapid response, you will have your Stencil delivered on-time.
Industry Directory | Consultant / Service Provider
Smart CAD Service can provide you with solutions to your SMT CAD Designs and economical solutions to cost reduction. We can help you reduce capital costs of infrastructure.
New Equipment | Solder Paste Stencils
For the DIYer, hobbyist or technical researcher there are times where all you need is a simple means to apply solder paste for SMT devices for a few simple boards. In those cases a plastic SMT stencil may be the right solution. Eliminate the tedious
Heller 1826 Mark 5 SMT Reflow Oven Reflow Oven SMT Reflow Oven Heller 1826 Mark 5 SMT Reflow Oven Heller 1826 Mark 5 Product description: Heller 1826 Mark 5 SMT Reflow Oven INQUIRY Heller 1826 Mark 5 SMT Reflow Oven Products de
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry News | 2012-06-09 14:33:06.0
To help designers and board assemblers address the challenges of working with new materials and smaller, finer-pitch components, IPC – Association Connecting Electronics Industries® released the B revision of IPC-7525, Stencil Design Guidelines.
Technical Library | 2014-03-13 15:25:01.0
A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production.
Technical Library | 2015-08-25 13:51:27.0
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil. The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process.
The most advanced ultrasonic stencil cleaning system! Clean solder paste, adhesives and flux residue in one machine Easy loading / unloading only 39" H Uses less chemistry Generates less wastewater Increased ultrasonic cleaning e
Events Calendar | Tue May 30 18:30:00 UTC 2023 - Tue May 30 18:30:00 UTC 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | Sherman, Texas USA | Engineering,Production,Research and Development,Technical Support
SMT Packaging Engineer: Location: Texas - Sherman , TX Group: HVAL Degree Requirements: BS ME/ChemE/Materials The person in this position will have the ability to make very significant financial contributions to TI because this is a very critic
Career Center | Porterville, California USA | Production
Please refer to Req. No.: 01-2154-0000-53 in all correspondence. * * * * * * Market Guidelines for Pay: $ 3474 � 5210/month. Excellent benefits package available. Supervise and provide process engineering support for the surface mount manufacturing
Career Center | Mysore, Tirane India | Engineering,Production,Quality Control,Technical Support
· New Product production line setup, Risk assessment, quality system deployment. · Process Engineering activities, PCB Design review w.r.t Design for manufacturability in Pilot lot. · Printed wiring Assembly Process Improvement (Stencil, PCB type, sc
SMTnet Express, February 15, 2018, Subscribers: 31,255, Companies: 10,892, Users: 24,401 Design Rules For Selective Soldering Assemblies Vitronics Soltec This document describes general guidelines and attention points for PCB design regarding
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
. The objective of the course shall be to define and demonstrate how the tests are conducted to successfully obtain a quality testing program. PDC05 Stencil Printing
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
. Various process techniques have been employed to reduce voiding including reflow profile modifications, nitrogen atmosphere reflow, and implementation of special solder paste formulations and stencil designs [17
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