Industry Directory | Manufacturer
UWELLPCB.com is the PCB supplier. We offer PCB from single side board, double side PCB to 32layer board,including the Rigid PCB, Flex PCB, Rigid-flex PCB,Quick-turn prototype and PCB assembly
Industry Directory | Consultant / Service Provider / Manufacturer
PROPOX is a manufacturer of electronics, industrial automatics, telemetric systems, tools, modules and evaluation circuits used by the constructors of electronics.
New Equipment | Education/Training
This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac
Thermal Profiler for reflow oven Accuracy: ±1 ℃ sampling number: 12000 internal protection temperature: up to 70 ℃ for 5 minutes Temperature range: 0-500 ℃ Product description: Thermal Profiler for reflow oven Thermal Profiler for ref
Electronics Forum | Tue Jun 30 18:37:19 EDT 1998 | Earl Moon
| Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | I would appreciate if somebody could help me in the stated issue: | I am trying to to place one thru hole 20 pin connector along with the SMT components by paste pri
Electronics Forum | Fri Jul 10 14:23:23 EDT 1998 | Bob Willis
You can get a report and CD ROM on pin in hole reflow assembly from the SMTA main office in the USA. They also have a new report on Double Sided Reflow Design and Assembly. | Hi all . | Thanks to Ryan, Brian , Justin and Dave for the timely help ear
Industry News | 2020-08-28 03:07:38.0
ITW EAE is proud to announce that it has earned two Vision Awards for innovative MPM and Electrovert technology developments. MPM received a Vision Award for a new paste monitoring system featuring temperature monitoring as well as upper and lower limit roll-height monitoring. Electrovert received a Vision Award for the new DwellFlex 4.0 variable contact wave solder nozzle. The awards were presented at NEPCON Asia.
Industry News | 2024-03-27 09:07:10.0
The world of PCB assembly is constantly evolving, and Red Glue SMT Solutions offer a revolutionary approach for double-sided printed circuit board assemblies (PCBAs). This innovative technique overcomes limitations of traditional solder paste and reflow ovens, paving the way for increased efficiency and cost savings.
Technical Library | 2019-06-26 23:21:49.0
Copper-filled micro-vias are a key technology in high density interconnect (HDI) designs that have enabled increasing miniaturization and densification of printed circuit boards for the next generation of electronic products. Compared with standard plated through holes (PTHs) copper filled vias provide greater design flexibility, improved signal performance, and can potentially help reduce layer count, thus reducing cost. Considering these advantages, there are strong incentives to optimize the via filling process. This paper presents an innovative DC acid copper via fill formulation, for VCP (Vertical Continues Plating) applications which rapidly fills vias while minimizing surface plating.
Technical Library | 2021-05-26 00:53:26.0
This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster, smaller and higher performance communication and electronic devices, build-up technology incorporating microvias has emerged as a viable multilayer printed circuit manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes and microvias are all attributes of these High Density Interconnect (HDI) packages. Filling the microvias with conductive material allows the use of stacked vias and via in pad designs thereby facilitating additional packaging density. Other potential design attributes include thermal management enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides potential advantages over alternative via plugging techniques. The features, development, scale up and results of direct current (DC) and periodic pulse reverse (PPR) acid copper via filling processes, including chemistry and equipment, are described.
https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/507.html Vision Measuring Machine and image measuring instrument can be used for dimensional accuracy measurement of various molds, aircraft, automobile, mobile phone, computer,
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
Events Calendar | Mon Mar 18 00:00:00 EDT 2019 - Mon Mar 18 00:00:00 EDT 2019 | ,
Webinar: Stencil Design for Solder Paste, In Process Inspection & Process Defects
Career Center | , | Engineering,Production,Quality Control
SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
SMTnet Express, June 27, 2019, Subscribers: 32,092, Companies: 10,819, Users: 24,882 Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper Credits: MacDermid Inc. Copper-filled micro-vias are a key
SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Stencil Design for Mixed Technology Through-hole / SMT Placement and Reflow by William E. Coleman, Photo
KingFei SMT Tech | https://www.smtspare-parts.com/sale-40803078-momentum-btb-printing-machine-mpm-speedline-solder-paste-printer.html
, Reflow Oven Checker Kic Profiler SMT Stencil Clean Wiper Paper Roll 20 x 530 x 400 x 10mm White Screen Printing Machine Parts Other Products LV-350W-TN Printing Machine Vacuum Suction Plate Loading Machine Brand
| https://www.smtfactory.com/What-are-the-working-principles-and-usage-skills-of-Full-auto-SMT-Stencil-Printer-id3506468.html
, the requirements for Full-auto SMT Stencil Printer are very high, the solder paste release effect is good, the printing process is relatively stable, and it is suitable for the printing of fine-pitch components
