Industry Directory | Manufacturer
Fine Line Stencil is committed to delivering the highest quality stencil technology in the industry.
Industry Directory | Manufacturer
Shenzhen Huancheng Automation equipment Co.,ltd (referred to as the "HC"), a High-speed developing enterprise specializing in High Precision Automatic Solder Paste Printer research and development.
New Equipment | Test Equipment
Hanwha SM471 Plus SMT Assembly Line Hanwha SM471 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:78000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach
New Equipment | Solder Paste Stencils
Fine Line Stencil is a technology leading manufacture, committed to delivering the highest quality laser stencils in the industry. We use the most advanced laser and material technologies available in the world to meet current and future industry de
Electronics Forum | Fri Mar 04 14:23:47 EST 2011 | mosborne1
Does anyone have any recomendations on 01005 stencil aperatures? Stencil thickness?
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Used SMT Equipment | Screen Printers
2014, Manncorp PB2300 semi-auto solder paste screen printer, with vision, good working condition. Also available with a 2014 Manncorp reflow oven and a 2008 MC387-V2 with feeders FOB: Origin / Ex-works Contact: AssuredTechnicalServiceLLC@Gmail.
Industry News | 2018-10-18 08:21:10.0
How to Prevent Non-Wetting Defect during the SMT Reflow Process
Technical Library | 2021-11-17 18:53:50.0
The demand for product miniaturization, especially in the handheld device area, continues to challenge the board assembly industry. The desire to incorporate more functionality while making the product smaller continues to push board design to its limit. It is not uncommon to find boards with castle-like components right next to miniature components. This type of board poses a special challenge to the board assemblers as it requires a wide range of paste volume to satisfy both small and large components. One way to address the printing challenge is to use creative stencil design to meet the solder paste requirement for both large and small components. ... The most important attribute of a stencil is its release characteristic. In other words, how well the paste releases from the aperture. The paste release, in turn, depends on the surface characteristics of the aperture wall and stencil foil. The recent introduction of new technology, nano-coating for both stencil and squeegee blades, has drawn the attention of many researchers. As the name implies, nano-coated stencils and blades are made by a conventional method such as laser-cut or electroformed then coated with nano-functional material to alter the surface characteristics. This study will evaluate nano-coated stencils for passive component printing, including 01005.
Technical Library | 2023-07-25 16:50:02.0
Some of the new handheld communication devices offer real challenges to the paste printing process. Normally, there are very small devices like 01005 chip components as well as 0.3 mm pitch uBGA along with other devices that require higher deposits of solder paste. Surface mount connectors or RF shields with coplanarity issues fall into this category. Aperture sizes for the small devices require a stencil thickness in the 50 to 75 um (2-3 mils) range for effective paste transfer whereas the RF shield and SMT connector would like at least 150 um (6 mils) paste height. Spacing is too small to use normal step stencils. This paper will explore a different type of step stencil for this application; a "Two-Print Stencil Process" step stencil. Here is a brief description of a "Two-Print Stencil Process". A 50 to 75 um (2-3 mils) stencil is used to print solder paste for the 01005, 0.3 mm pitch uBGA and other fine pitch components. While this paste is still wet a second in-line stencil printer is used to print all other components using a second thicker stencil. This second stencil has relief pockets on the contact side of the stencil any paste was printed with the first stencil. Design guidelines for minimum keep-out distances between the relief step, the fine pitch apertures, and the RF Shields apertures as well relief pocket height clearance of the paste printed by the first print stencil will be provided.
SMT Nozzle Cleaning Machine ETA-24/36 If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA Cleaning Machine, On-line PCBA Cleaning Machine,
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SMT EXPERT WITH DOE ,DFM AND LEAN SKILLS
0201 and 01005 Adoption in Industry 0201 and 01005 Adoption in Industry First introduced in the year 2000, the 0201 package was sold in significant numbers in the electronics industry by 2003. According to some estimates, it currently accounts
01005 Assembly, the AOI route to optimizing yield News Forums SMT Equipment Company Directory Calendar Career Center Advertising About FREE Company Listing! 01005 Assembly, the AOI route to optimizing yield. The increasing demand
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. There is a mismatch between the plating layer material and the applied solder paste. For 0201 and 01005 sized chips, since the amount of printed solder paste is thinner, the flux in the solder paste evaporates more quickly thus affecting the wetting properties of solder paste when
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic1384&OB=DESC.html
0.10 mm for the 01005 package. Then the 0201 was set in the middle at 0.12 mm Toe. Thinning the paste mask stencil is also required but that information will reside in the new IPC-7070
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