New Equipment | Solder Materials
FCT Solder has positioned itself as a leader in lead-free solder products. As a licensee of Nihon Superior’s patented technology, we manufacture and sell the leading lead-free alloy, SN100C. FCT Solder is the original licensee of Nihon Superior’s tec
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
Electronics Forum | Tue Dec 23 17:34:07 EST 2008 | davef
We hear you talking two main issues: 1 Solder paste release 2 Thoughts on using two passes of solder paste on the stencil 1 Solder paste release * Check your aperture & aspect ratios [Search the fine SMTnet Archives for more] * Do a better job with
Electronics Forum | Thu Dec 16 15:00:20 EST 2004 | glaucon
Simple differences. Both processes require a very similar machine platform, controlled motion, vision fiducial recognition and alignment of a substrate (PCB or hybrid ceramic) to the "image", the image being either a stencil (hence stencil printing)
Industry News | 2020-04-14 19:07:23.0
ITW EAE introduced the next-generation MPM® Momentum® II Printer with the release of the HiE and Elite models in November of 2019. Now the company is releasing the Momentum II BTB and Momentum II 100. The Momentum II BTB is a Back-to -Back configurable stencil printer that allows dual-lane processing for higher throughput without increasing either line length or capital investment.
Industry News | 2019-11-05 12:11:26.0
ITW EAE is introducing the MPM® Momentum II™ Printer as the next generation of the highly successful Momentum printer line. The Momentum II features a new set of enhanced technologies that bring further advancement in quality, yield, productivity, ease of use and flexibility.
The MPM Momentum II is a proven, highly productive printer platform with a new set of enhanced technologies for further improvement around machine productivity, yield, ease of use, and flexibility.
| http://etasmt.com/cc?ID=te_news_bulletin,23574&url=_print
• Improper solder volume due to improper stencil design • Paste viscosity too low • Paste metal content too low • Bad or expired solder paste
Heller Industries Inc. | https://hellerindustries.com/voids/
before it solidifies. Process and design-related causes of circuit board voids: Improper solder volume due to improper land design Improper solder volume due to blocked stencil aperture Improper solder volume due to improper stencil design Paste viscosity too low Paste metal
