Industry Directory | Manufacturer
Manufacturer of Laser cut stencils, thick film screens, large format screens. Variety of stainless steel materials and mesh, ITAR registered. Member of SMTA, IMAPS and IPC.
Industry Directory | Manufacturer
professional manufacturer of pcb
New Equipment | Solder Paste Stencils
SMT Foil Stencils are laser cut solder paste stencils designed to work on their own for hand printing or with stencil tensioning systems. These laser cut stencils do not need to be permanently glued in a frame. These so-called frameless stencils are
New Equipment | Solder Paste Stencils
SMT Prototype Stencils are laser cut solder paste prototype stencils designed to work on their own for hand printing. These laser cut prototype stencils do not need to be permanently glued in a frame. These so-called framelessstencils are less expens
Electronics Forum | Thu Jun 14 06:13:47 EDT 2012 | ccgooi
I am running a product with board size ~18"X16". I faced stencil aperture positional accuracy issue which slightly shifted at both end of stencil at positive and negative in X direction thus causing solder paste to pad mis-registration. Due to this s
Electronics Forum | Thu Mar 06 10:57:28 EST 2003 | Mark
What are the recommended stencil apertures for a TSOP40. Lead pitch 0.48mm & lead width 0.21mm. And direction of squeegee print over the aperture? Recommended Stencil thickness? Recommended aperture reductions? Recommended pcb pad sizes? Recommended
Used SMT Equipment | Screen Printers
Momentum is designed to provide efficiency and speed. With its triple track conveyor rails and servo drive motors, for example, the Momentum Elite model orders the highest performance capacity in the series, making it the ideal printer for high volum
Used SMT Equipment | Screen Printers
DEK 03iX Specs: • Process alignment capability 2 Cpk @ ± 25µm 6-Sigma • Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma • 12 second cycle time • High Throughput Conveyor (option) , enables core cycle time reduction to just 11 seconds • DE
Industry News | 2003-03-21 08:12:24.0
Tecan reckons it is consistently producing what may be regarded as the most efficient stencils in the world today.
Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
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Parts & Supplies | Pick and Place/Feeders
JUKl FX3 Ejector Unit Assy 40112421 Part number: 40112421 Application: FX3 Brand: JUKI FX3 Ejector Unit Assy 40112421 is a spare part for JUKI pick & place machine FX-3, ZK Electronic Technology have original new in stock, if you consider it
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2014-06-05 16:44:07.0
Stencil printing capability is becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.(...) The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Momentum was designed and built to be a no-nonsense production machine. Cost-efficient and featuring a modest footprint, it grows with the user; innovative patented features can be added on or retrofitted as needed as the user’s throughput dema
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA
Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology
Career Center | , | Engineering,Production
Project Management, SMT Process Engineering
SMTnet Express, April 16, 2020, Subscribers: 35,920, Companies: 10,989, Users: 25,757 Stencil Printing 008004/0201 Aperture Components Credits: ITW EAE This paper will focus on the application requirements of solder printing small aperture designs
Stencil Printing of Small Apertures SMTnet Express October 25, 2012, Subscribers: 25748, Members: Companies: 9022, Users: 33865 Stencil Printing of Small Apertures First published in the 2012 IPC APEX EXPO technical conference proceedings
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_dispensers_camelot2800.html
Nd:YAG Marking Laser System Infared Laser, 1064Nm Unidex 11 Control Fixed Aperture Size: Aperture #2 is fixed until #1 is called Paddle Aperture #1 Size: .0635” Paddle Aperture #2 Size: 0=.08” Upcollimator: 6X Scan Field: 12” x 12” Focus Stick Length: 15.25” Paddle Aperture #1: 18 Watts
| http://etasmt.com/cc?ID=te_news_bulletin,23570&url=_print
• Skips in the printed solder due to blocked stencil aperture • Misaligned solder print • Improper stencil thickness • Inadequate stencil aperture size
