New Equipment | Assembly Services
K & F Electronics Website: https://circuitboards.com/ Email to send Gerber files and or BOM: info@circuitboards.com Phone: 888-722-5310 Assembler and Manufactuer of Printed Circuit Boards (PCB) K & F Electronics has the capability to produce a
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Industry News | 2003-04-08 14:01:01.0
Sparton's design engineering team is one of 265 worldwide members in the Motorola Design Alliance program.
Industry News | 2003-03-04 08:31:59.0
Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market
Technical Library | 2024-08-29 18:30:46.0
The mechanical experience of consumption (i.e., feel, softness, and texture) of many foods is intrinsic to their enjoyable consumption, one example being the habit of twisting a sandwich cookie to reveal the cream. Scientifically, sandwich cookies present a paradigmatic model of parallel plate rheometry in which a fluid sample, the cream, is held between two parallel plates, the wafers. When the wafers are counterrotated, the cream deforms, flows, and ultimately fractures, leading to separation of the cookie into two pieces. We introduce Oreology (/Oriːˈɒl@dʒi/), from the Nabisco Oreo for "cookie" and the Greek rheo logia for "flow study," as the study of the flow and fracture of sandwich cookies. Using a laboratory rheometer, we measure failure mechanics of the eponymous Oreo's "creme" and probe the influence of rotation rate, amount of creme, and flavor on the stress–strain curve and postmortem creme distribution. The results typically show adhesive failure, in which nearly all (95%) creme remains on one wafer after failure, and we ascribe this to the production process, as we confirm that the creme-heavy side is uniformly oriented within most of the boxes of Oreos. However, cookies in boxes stored under potentially adverse conditions (higher temperature and humidity) show cohesive failure resulting in the creme dividing between wafer halves after failure. Failure mechanics further classify the creme texture as "mushy." Finally, we introduce and validate the design of an open-source, three-dimensionally printed Oreometer powered by rubber bands and coins for encouraging higher precision home studies to contribute new discoveries to this incipient field of study
Technical Library | 2010-04-22 14:55:51.0
It is now widely accepted that using designed experiments is the most effective way to optimize surface mount technology (SMT) processes. This situation begs the question "what is an effective strategy in implementing this powerful tool?" This paper will present such a strategy that incorporates Taguchi's approach for screening, full factorial analysis for optimization and central composite design for precise modeling. We will present these techniques using MINITABTM Release 13 statistical software and printed circuit board industry applications.
Advanced Assembly offers services such as turn-key services, consignment or a combination of both. Advanced Assembly uses a patented BOM Builder in order to make sure there are no errors in your order, and provides quick-turn output by using an autom
Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 1 of 3)
Events Calendar | Wed Jun 07 00:00:00 EDT 2023 - Wed Jun 07 00:00:00 EDT 2023 | ,
Chapter Webinar Series: Solving Real-Life Problems Using the Tools of Lean Six Sigma (Part 2 of 3)
Career Center | Frankfurt, Germany, Europe United Kingdom | Sales/Marketing
We are currently recruiting for a Director of Sales and New Business Development selling CEM services throughout Europe. This position will be responsible for further developing the European territory that currently has business scattered throughout
SMT Express, Volume 3, Issue No. 7 - from SMTnet.com Volume 3, Issue No. 7 Thursday, July 18, 2001 Featured Article Return to Front Page Book Review Reviewed by Dave Fish (davef ), Pandion Electronics, Inc. Title: Printed Circuit Assembly
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
(Improved Design Life and Environmentally Aware Manufacturing of Electronic Assemblies by Lead-Free Soldering), and the Japan Electronics and Information Technology Industries Association (JEITA
| https://unisoft-cim.com/test-fixture_download.htm
. For "Bed of Nails" type In-Circuit ATE testers: Import the CAD and BOM files into the Unisoft software. Design the "Bed Of Nails" test fixture and create the test fixture fabrication files
