Industry Directory | Consultant / Service Provider / Manufacturer
Los Angeles Printing Company with offset, wide format, digital and mailing capabilities. Trade show banners and materials, full color booklets, postcard printing, movie posters, window signs and more!
The 850 DWMS (Die Wire Metrology System) provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum defect, and measurement capabilities for Lead-Frame, Die and Wire-
Nanovea 3D Non-Contact Profilometers are designed with leading edge optical pens using superior white light axial chromatism. Nano through macro range is obtained during measurement (Profile Dimension, Roughness Finish Texture, Shape Form Topography,
Electronics Forum | Thu Aug 16 14:15:11 EDT 2007 | hussman
I agree with Doug. Stop the bleeding first, then find and stitch the wound up.
Electronics Forum | Wed Dec 28 16:03:53 EST 2005 | Chris
I have lots of experience with thermosonic gold ball bonding. You can read the literature and you will probably find some papers that say you can do it. I have never been able to do it. We gold ball bond all day long with little problems at all bu
Industry News | 2013-03-07 11:20:46.0
Semikron (SEMIKRON International GmbH) manufactures components and systems for power electronics.
Industry News | 2003-05-05 09:13:55.0
Reliable Wire Bonders for High Yield Production
Parts & Supplies | Chipshooters / Chip Mounters
RADIAL UPPER PUSHER part no.44426606 Part Number Description Part Number Description 50873202 BELT, Z DRIVEN, FLEX HEAD, CURV 50891801 OFFLINE SETUP (ENGLISH) 50873701 CABLE ASM,BCR POWER, CONV T 50892801 Silencer, 1/2 NPT 50879
Technical Library | 2011-02-17 18:03:21.0
Copper ground pours are created by filling open unused areas with copper generally on the outer layers of the board then connecting the copper fill with stitching vias to ground. Usually, small isolated areas
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
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Training Courses | | | PCB Rework and Hand Soldering Courses
The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.
Career Center | Delhi, India | Maintenance,Production,Sales/Marketing,Technical Support
7 Years of experiance in SMT line
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– Stitch Splice Tool 51313501 – 8mm Punched Splice Tool Brass Stitch and Tape 50934201 – 8mm Brass Stitch and Tape Splices, 500 Pieces 50934301