Electronics Forum | Wed May 23 15:58:01 EDT 2018 | mcurtin2011
Those patterns are either: a) the stencil has recieved some streching stress - either being pushed on and dented by some obstruction, or b) has been worn thin and therefore streched as a result. This type of change to your foil may cause a slight sh
Electronics Forum | Thu Oct 20 06:03:23 EDT 2005 | Slaine
during the soldering process on larger BGAs the corners can bend up or down due the large copper heatsink on top expanding quicker than the material the bga is made out of, in the worst cases this can lead to to the balls lifting out of the paste and
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