New SMT Equipment: stress relief (5)

PCB Depanelizer PCB Router Machine with Smart Software Gerber

PCB Depanelizer PCB Router Machine with Smart Software Gerber

New Equipment | Depaneling

PCB Depanelizer Features: 1. Smooth cutting finish only by router cutting . 2. There is little distortion on PCB during cutting because using high-frequency spindle motor . It is 1 / 10 of pressing , 1 / 100 of breaking by hand . 3. One-touch progr

ChuangWei Electronic Equipment Manufactory Ltd.

PCB Laser Depaneling Services

PCB Laser Depaneling Services

New Equipment | Depaneling

If you have boards requiring high tolerance mechanical dimension or odd shapes that traditional depaneling methods cannot handle. BEST Inc. provides laser depaneling services for printed circuit board manufacturers as well as EMS and OEMs. BEST’s nu

BEST Inc.

Electronics Forum: stress relief (12)

Ball Grid Array (BGA)

Electronics Forum | Thu Sep 10 11:57:20 EDT 1998 | James Michaud

I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress reli

Re: Ball Grid Array (BGA)

Electronics Forum | Fri Sep 11 00:52:19 EDT 1998 | Rick Thompson

| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re

Industry News: stress relief (6)

Session 2 Agenda for the High-Reliability Cleaning and Coating Conference

Industry News | 2012-10-18 19:02:31.0

IPC and SMTA jointly announce the agenda for Session 2 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel

Association Connecting Electronics Industries (IPC)

Newly Upgraded Vishay Power MOSFET is Improved for Automotive Applications

Industry News | 2021-01-05 11:01:03.0

New Vishay Siliconix 40V Automotive Grade MOSFET Provides Lower Thermal Resistance and a Lead Frame for Extended Board-Level Reliability

New Yorker Electronics

Technical Library: stress relief (2)

Effect of Silicone Conformal Coating on Surface Insulation Resistance (SIR) For Printed Circuit Board Assemblies

Technical Library | 2013-04-18 16:46:42.0

Conformal coatings are considered a method of providing corrosion protection to electrical assemblies used in high-humidity or harsh environments. They are applied to PCBs for various reasons: to protect from moisture and contamination, to minimize dendritic growth, to provide stress relief, and for insulation resistance. These contribute to more durable handling, enhanced device reliability, and reduced warranty costs. Increased miniaturization of new circuit board designs requires flexible, low stress coating material to protect delicate components and fine-pitch leads. Silicone conformal coatings offer many advantages that address the general trend of ongoing PCBs designs, such as: high flexibility and low modulus to reduce stress on delicate or small components... First published in the 2012 IPC APEX EXPO technical conference proceedings.

Dow Corning Corporation

ADVANCED BORON NITRIDE EPOXY FORMULATIONS EXCEL IN THERMAL MANAGEMENT APPLICATIONS

Technical Library | 2020-10-14 14:33:36.0

Epoxy based adhesives are prevalent interface materials for all levels of electronic packaging. One reason for their widespread success is their ability to accept fillers. Fillers allow the adhesive formulator to tailor the electrical and thermal properties of a given epoxy. Silver flake allow the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative thermal interface materials like silicones, greases, tapes, or pads. The paper discusses key attributes for designing and formulating advanced thermally conductive epoxies. Comparisons to other common fillers used in packaging are made. The filler size, shape and distribution, as well as concentration in the resin, will determine the adhesive viscosity and rheology. Correlation's between Thermal Resistance calculations and adhesive viscosity are made. Examples are shown that determination of thermal conductivity values in "bulk" form, do not translate into actual package thermal resistance. Four commercially available thermally conductive adhesives were obtained for the study. Adhesives were screened by shear strength measurements, Thermal Cycling ( -55 °C to 125 °C ) Resistance, and damp heat ( 85 °C / 85 %RH ) resistance. The results indicate that low modulus Boron Nitride filled epoxies are superior in formulation and design. Careful selection of stress relief agents, filler morphology, and concentration levels are critical choices the skilled formulator must make. The advantages and limitations of each are discussed and demonstrated.

Epoxy Technology, Inc.

Videos: stress relief (1)

PCB Laser Depaneling

PCB Laser Depaneling

Videos

This video demonstrates firsthand the precision of BEST's high output UV laser (25um cut width, +/1 4um precision) for cutting FR-4 thick rigid boards. This same laser depaneling can be used when your IoT boards need to be precisely fit in to an encl

BEST Inc.

Training Courses: stress relief (1)

Hands-On Solder

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Skolnik Technical Training Institute, LLC

Express Newsletter: stress relief (76)

Partner Websites: stress relief (26)

CF8 - Component Forming Dies

GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Die-Catalog-800-000.pdf

& 8 800H-1100 .015/ .062 (7 piece) 800H-1000 .015/ .030 (3 piece) 800H-3000 .030/ .045 (3 piece) 800H-4000 .045/ .062 (3 piece) TYPE #2A STRESS RELIEF KIT

GPD Global


stress relief searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t t t t t t t net
  1 2 3 4 5 6 7 8 9 10 Next
2024 Eptac IPC Certification Training Schedule

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
See Your 2024 IPC Certification Training Schedule for Eptac

Best Reflow Oven
Software for SMT

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Hot selling SMT spare parts and professional SMT machine solutions

Reflow Soldering Oven & Pressure Curing Oven Manufacturer in India