Manufactures a wide range of environmental test solutions capable of temperature and humidity cycling, thermal shock, production stress screening, accelerated stress testing, combined environment testing, controlled humidity exposure.
Industry Directory | Manufacturer
Founded in 1986, Zymet is a manufacturer of adhesives and encapsulants used in electronics and microelectronics assembly.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
Cut panels without scoreline and with overhanging components. The S300 diamond blade depaneling saw is ideal for use in singulating assembled PCBs. Singulate panels up to 12" wide. Microprocessor controlled STI safety interlock Long Lasting Di
Electronics Forum | Tue May 05 21:17:46 EDT 2015 | warwolf
So, im tasked to outline that the centre of a 28cm x 20cm PCB has the most susceptible stresses in the centre, my reson is to avoid putting the BGA there. I had a really good article outlining this but I carnt find it. can anyone help?
Electronics Forum | Thu Sep 02 16:52:31 EDT 1999 | Earl Moon
| | | Has anyone done or seen any studies done documenting what may be the affect of hardware such as screws in the parimeter vicinity of BGAs on a circuit board? | | | | | | What I'm really after is anything describing how close a screw/washer/nut
Used SMT Equipment | Pick and Place/Feeders
Panasonic placement machine cm212 features one: Achieved a maximum of 54,000 CPH (0.067s/pcs) Actual efficiency 38,000 CPH (0.098s/pcs) Substrate transport time…3.6 s (～substrate X=215㎜)
Used SMT Equipment | Depanelizers / Routers
Key Features Solution for stress free depanelization Fixture-based highly efficient dust vacuum system Clean and precise depanelization for densely populated PCBs Advanced image-processing software offers point-and-click operation fo
Industry News | 2019-01-09 21:58:38.0
GPD Global will exhibit at IPC APEX EXPO 2019. Stop by Booth 2915 to see live demonstrations of machines and equipment. Experts will be there to discuss your production needs. Whether your project requires a pump for retrofitting or a fully automated dispense system, conformal coating, or component preparation, we have a solution for you.
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Parts & Supplies | SMT Equipment
PCB Separator machine L100 Parameters: 1.maximum of board length: 200mm 2.board thickness:0.4~3mm 3.speed of sending board: it depends 4.material of knife:HSS 5.Volume:580mm(L) ×380mm(W) ×250mm(H) 6.weight:15kg Feature: 1.Minimize the inte
Parts & Supplies | SMT Equipment
V-CUT Banding Transportation Machine,PCB Depaneling machine Specifications 1. All PC boards with a V-cut are suitable for the V-CUT PCB separator. 2. It is very easy to operate for the PCB separator. FEATHERS 1. All PC board
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2023-08-16 18:20:44.0
One of our defense customers planned to dispense underfill material for small and large die, using Hysol FP4545FC epoxy encapsulant. This process dissipates stress on solder joints and prevents cracking and fracturing between the bottom of the die and the surface of the substrate.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Tue Sep 15 00:00:00 EDT 2020 - Tue Sep 15 00:00:00 EDT 2020 | ,
Multitasking Makes You Stupid
Events Calendar | Thu Jul 22 00:00:00 EDT 2021 - Thu Jul 22 00:00:00 EDT 2021 | ,
Webinar: Effective Strategies to Sharpen Your Focus and Concentration
Career Center | Detroit Metro area, Michigan USA | Engineering,Maintenance,Production,Technical Support
Technicians from entry level to senior level pro's. Prefer experience with one or more of the following OEM Equipment brands. Universal Instruments Speedprint Europlacer SMT (of Germany) Reflow Ovens Sanyo Panasonic DEK
Career Center | Detroit Metro area, Michigan USA | Engineering,Maintenance,Research and Development,Technical Support
Engineers Wanted for immediate and rare opportunities. Desired Characteristics 4 year Engineering degree or active Engineering students Attention to detail and Due Diligence centered Professional work ethics Effective communicat
Career Center | Singapore, Singapore | Technical Support
I have good skill with Technical oriented. Please check my resume.
Career Center | , District of Columbia | Engineering,Management,Production,Sales/Marketing
• Strong technical leadership and decision-making skills; strong verbal and written communication skills to provide clear, crisp direction for key issue resolution; and good team skills to facilitate cross-functional cross -site team effectiveness.
Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal
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. Too small solder joints have insufficient mechanical strength and cannot withstand the stresses in use, even the internal stresses existing after welding cannot be sustained
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/industries
Industry DIMA Products Corporate | Global Directory | Languages Division Only All of Nordson Industries Aerospace The Aerospace and Defense Industries both require cutting edge technology, requiring components and products that can survive extreme stresses
