Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
New Equipment | Assembly Services
Alltemated can assemble, configure and test your products. From sub-assembly to complete box build, Alltemated has an experienced staff to support your outsourcing requirements. Product Design and Development Alltemated's engineering group can provi
Electronics Forum | Fri Sep 02 10:10:54 EDT 2005 | Mity-C
We had a customer who came in to discuss a solder adheasion problem on some sub-assemblies we were building for them. When they arrived, they put a sub assembly in a vise and hit it with a hammer. I was speechless to say the least...... C
Electronics Forum | Tue May 13 08:02:28 EDT 2008 | avalancher
Interesting thought. Among the many thoughts that came to mind while reading your post, one stands out for me. While making a cost effective machine is a great idea, it seems obvious that there will be some trade offs on quality. The cheaper the ma
Used SMT Equipment | Repair/Rework
The Conceptronic Freedom 3000 printed circuit board repair station is designed for component rework, low volume prototype reflow soldering and process development. The Freedom 3000 machine structure is accurate, rigid, and stable in order to repeated
Used SMT Equipment | In-Circuit Testers
Fluke 54200-M01 The Fluke 54200 TV Signal Generator offers sound test signals and a highly stable RF output, making it ideal for complete testing of TV sets, VCRs or other related equipment. The Fluke 54200 offers single or multiple TV standards
Industry News | 2014-07-28 08:49:26.0
Cogiscan Inc. is pleased to introduce a new Genealogy Module.
Industry News | 2015-10-11 17:14:31.0
Gen3 Systems Limited is pleased to announce that it has re-signed its distribution agreement with Partnertec in Benelux for an additional two years. Gen3 has been working with Partnertec for the past three years.
Parts & Supplies | Pick and Place/Feeders
Y-Axis Cover 1 Sub Assembly
Parts & Supplies | Pick and Place/Feeders
Y-Axis Cover 2 Sub Assembly
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Events Calendar | Wed Apr 11 00:00:00 EDT 2018 - Thu Apr 12 00:00:00 EDT 2018 | Dresden, Germany
Smart Systems Integration Exhibition
Career Center | Dallas, Texas USA | Engineering
Skills/Requirements: 5+ years of test design at the component, sub assembly, assembly and system level. ATE design, test software using Labview, optical and/or RF communications is preferred, OWDM,DC-48/192 highly desired. Duties/Functions: Takes le
Career Center | , California Malaysia | Sales/Marketing
This is a position where the candidate is required to have knowledge in custom wire-harness, cable assembly, printed circuit board assembly (both PTH & SMT) and electro-mechanical sub-assembly. The job is independant manufacturer representative and b
Career Center | , New Jersey USA | Engineering,Management,Production,Research and Development
A highly experienced Engineering/Manufacturing Manager with 40 years of experience in electronic/mechanical design and manufacturing. Recent years, specializing in electronic manufacturing with emphasis on Surface Mount Technology. Currently employed
Career Center | San Diego, California USA | Production
VAN D THACH 4471 54th Street, San Diego, CA 92115 Home phone: (619) 453-3877 Email vanth11103@yahoo.com RESUME Objective Electrical and Mechanical Assembly. Education _ San Diego City C
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/3681.html
: Y-Axis Cover 1 Sub Assembly Y-Axis Cover 1 Sub Assembly PREVIOUS： 03054109S01 NEXT： 03054117-03 RELATED PRODUCTS CATEGORIES ABOUT US
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/about-us/news/nordson-efd-helps-medical-manufacturers-meet-demand-for-covid-19-treatment-and-diagnostic-4-9-20
symptoms of the novel coronavirus (SARS-CoV-2). A robotic system integrator contacted Nordson EFD on Wednesday, March 25 looking to order multiple automated dispensing systems to mass produce a small sub-assembly inside Ventec Life Systems’ unique ventilators
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