A-Sub is professional SMT manufacturer. Our major customer is ASUS computer. We get long term subcontract for ASUS mother board manufacture.
New Equipment | Assembly Services
If you are an EMS provider or OEM of electronic/electrical components or sub-assemblies incorporating plastics, metals, ceramics or any combination of these, BEST Inc can offer you knowledgeablePCB x-ray inspection services. BEST experiences in thes
New Equipment | Education/Training
The IPC J-STD-001 Training for the instructor is a class on the necessities for Soldered Electrical and Electronic Assemblies is a universal standard with wide acceptance on the assembly of printed circuit boards. The IPC J-STD-001 Training explains
Used SMT Equipment | SMD Placement Machines
* DOS * Flying Nozzle change * Fiducial camera * Pneumatic tape feeder * Locate Pin * Edge clamp * Z servo push plate * Entrance sub stop * Exit sub stop * Auto width adjust * Feeder float detection
Used SMT Equipment | SMD Placement Machines
* Windows NT * Super fine head * Line Array camera * Pneumatic Tape Feeder * Locate pin * Edge Clamp System * Z servo push up plate * Entrance sub stopper * Exit sub stopper * Auto width adjust * Hi
Industry News | 2003-04-08 10:28:06.0
A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.
Industry News | 2003-04-21 09:53:12.0
Michael T. O'Neill and Peter J. Simone
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
Technical Library | 2008-01-24 16:19:43.0
The wave solder process is characterized by a large number of process parameters. To understand them all and their interactions is challenging, particularly when it comes to lead-free soldering. Wave soldering has a number of sub-processes, which include fluxing, preheating, soldering and cooling.
BGA integrated circuits and chip scale packages, CSPs where the solder connections are not visible. This has arisen as a result of the need for greater numbers of interconnections to integrated circuit packages and as a general result of increasing c
Training Courses | | | ESD Control Training Courses
Browse training and certification programs for electrostatic discharge (ESD) control in electronics assembly.
Events Calendar | Wed Oct 13 18:30:00 UTC 2021 - Wed Oct 13 18:30:00 UTC 2021 | ,
Oregon Chapter Webinar: Supplier Relationship Management (SRM) During Crisis!
Events Calendar | Mon Jul 10 18:30:00 UTC 2023 - Mon Jul 10 18:30:00 UTC 2023 | Oshkosh, Wisconsin USA
Wisconsin Chapter In-Person Event: PCB Workshop and PCB Plant Tour
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Career Center | BANGALORE, KARNATAKA India | Engineering,Production,Quality Control,Research and Development
ESSEN IS MEDIUM SIZED COMPANY INVOLVED IN CONTRACT MANUFACTURING,SUB CONTRACT ACTIVITY IN ELECTRONICS AND CABLE ASSEMBLIES.WE ARE LOOKING FOR OVERSEAS TIEUPS FOR PRODUCTS AND MASS PRODUCTIONS ACTIVITIES.INTERESTED PARTIES CAN LOG ON TO www.essenelec
Career Center | , Florida USA | Engineering,Management,Production,Technical Support
Fifteen years in sub-contract manufacturing.
Career Center | Herne Bay, Canterbury, Kent United Kingdom | Engineering,Management,Production
01/2002-02/2008 (EMS) Last five years work as SMT Supervisor: MYDATA TWO TP09,ONE MY12,TWO MY9 (synergy). AOI programming (TESTWORK).SPC data analyse, ovens profiling. i had six peoples i was in charge off . I was doing the planning, base on LEAN & M
