Industry Directory | Consultant / Service Provider / Equipment Dealer / Broker / Auctions / Manufacturer's Representative / Training Provider
Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.
Industry Directory | Recruiter / Employment Company
Engineering, Manufacturing and Defense recruiting.
Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
New Equipment | Tape and Reel Equipment
ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment. The preform is placed directly into the solder paste prior to assembly reflow. Alpha So
Electronics Forum | Fri Jul 16 15:30:22 EDT 1999 | SMTASSY
Perhaps a little hard to find but is there anyone who uses a vapor phase process to solder populated card with BGAs. I am interested in the success rate of such a process. It is obvious that the throughput is reduce vs a convection oven but still thi
Electronics Forum | Fri Dec 08 09:48:11 EST 2006 | SMTRework
Hi Guys / Gals, just curious as to how some of you approch BGA pad damage? (ie broken or lifted pads) Also, what kind of success rate have you found with your method?
Used SMT Equipment | In-Circuit Testers
JDSU FireBerd 8000-CFB8000-02-C2000-V6 Communications Analyzer JDSU FB8000 The FIREBERD 8000 combines the success of two highly successful test platforms - the FIREBERD 6000A and the TestPad. As a datacom analysis module for the TestPad, the por
Used SMT Equipment | In-Circuit Testers
JDSU FireBerd 8000-CFB8000-02-C2000-V6 Communications Analyzer JDSU FB8000 The FIREBERD 8000 combines the success of two highly successful test platforms - the FIREBERD 6000A and the TestPad. As a datacom analysis module for the TestPad, the por
Industry News | 2014-09-06 19:18:17.0
Briefing Co-hosted by IPC as Part of Continuing Effort to Connect IPC Members with Policymakers.
Industry News | 2012-04-06 15:32:39.0
GPD Global, a manufacturer of precision fluid dispensing systems for high-volume 24/7, low-volume/high-mix and R&D production, announces the global release of its PCD4 Dispense Pump after its successful release and testing in the North American market.
Technical Library | 2021-01-03 19:24:52.0
Reflow soldering is the primary method for interconnecting surface mount technology (SMT) applications. Successful implementation of this process depends on whether a low defect rate can be achieved. In general, defects often can be attributed to causes rooted in all three aspects, including materials, processes, and designs. Troubleshooting of reflow soldering requires identification and elimination of root causes. Where correcting these causes may be beyond the reach of manufacturers, further optimizing the other relevant factors becomes the next best option in order to minimize the defect rate.
Technical Library | 2017-04-20 13:51:14.0
The one constant in electronics manufacturing is change. Moore's Law, which successfully predicted a rate of change at which transistor counts doubled on Integrated Circuits (ICs) at lower cost for decades, is ceding to be an appropriate prediction tool. Increasing technical and economic requirements, deriving from the semiconductor environment, are cascaded down to the printed circuit and in particular to the IC substrate manufacturers. This is both a challenge and an opportunity for IC Substrate manufacturers, when dealing with the demands of the packaging market. (...)This paper introduces two new electroless copper baths developed for IC substrates manufacturing based on Semi Additive Process (SAP) technology (hereafter referred to as E'less Copper IC) and HDI production (hereafter referred to as E'less Copper HDI) and optimized for high throw into BMVs. An introduction to reliable throwing power measurement methods based on scanning electron microscope (SEM) is given, followed by a compilation and discussion of key performance criteria for each application, namely throwing power, copper adhesion on the substrate, dry film adhesion and reliability.
http://www.gpd-global.com No drip no drool across a wide range of fluid viscosities (low-to-mid and low-to-high). No manual adjustment to compensate for pump variability. Truly Volumetric PCD Pumps for total control of dispensing fluids. Ability to
ASM SIPLACE SX SMT Placement SMD Chip Shooter If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included allof our products. Pick and place machine, SMT pick and place mach
Training Courses | | | IPC-A-610 Specialist (CIS) Recert.
The Certified IPC-A-610 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC-A-610 Specialists.
Training Courses | | | IPC J-STD-001 Specialist (CIS) Recert.
The Certified IPC J-STD-001 Specialist (CIS) recertification courses are intended for those individuals who were previously certified as IPC J-STD-001 Specialists.
Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Career Center | Nationwide, Various USA | Management,Sales/Marketing
World-wide electronics industry leader seeking a managers of sales / operations nationwide. This position will direct tracking of all company sales activity statistics involving customers, targets, bids/proposals, success rate and strategy. Heavy m
Career Center | 94539, California USA | Management
Responsible for ensuring customer fill rate and inventory goals are met. Analyze sales forecasts, history, and inventory to develop supply capacity plans. Day to Day Materials Management – manage material supply and demand including demand lo
Career Center | Chennai, India | Sales/Marketing
Experience in sales of inter-connect, passive, active, and electro-mechanical components Product Engineering Role as handling BOM, ECO, ECN in the New product introduction of Philips LCD TV and Kulicke and Soffa wire bonding m/c Process and Quali
Career Center | chennai, India | Engineering,Maintenance
Nokia India Pvt LTD. Sriperumpudur – Board Assembler Maintenance Technician from Sep 2009 to till now. Machines Handled Pick & Place : FUJI NXT Machines FUJI NXT - M3 II ,M3S. Reflow oven: Hot flow 3/20, 2/14. Stencil Pr
Controlled Convection Rates Maximizing process control with controlled convection rates BTU International Credit/Source: Rob DiMatteo, Fred Dimock, Pierre LeMieux Todays convection ovens are equipped with several key control elements. One
| https://www.smtfactory.com/SMT-Automatic-Intelligence-Splicing-Machine-pd40418362.html
. accurate, patented structure design, success rate 98%. Feeding system Mold manufacturing, more than 2000 machines are verified in the customer's factory, with perfect stability
| https://ipcapexexpo.org/exhibitors/important-dates-deadlines
. December 31, 2020 IPC APEX EXPO 2021 Innovation Awards Application Deadline January 15, 2021 Advance Rate Deadline for Lead Retrieval February 1, 2021 Deadline to order
winsouce.jpg)
