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Series 7100 Moisture in Gases Analyzer: detects H2O from 2-200 ppm - for corrosive or non-corrosive applications, i.e., argon, flourocarbons, helium, hydrogen, nitrogen, oxygen, chlorine, hydrogen chloride, hydrogen sulfide, phosgene, sulfur dioxide
Electronics Forum | Thu Aug 21 09:05:07 EDT 2003 | davef
Use a cartridge that's approved [conform to OSHA 42 CFR 84] to provide respiratory protection against organic vapors, chlorine, hydrogen chloride, sulfur dioxide, chlorine dioxide, and hydrogen fluoride with a P100 particulate filter which is effecti
Electronics Forum | Fri May 21 12:24:21 EDT 1999 | KA Stillings
I normally handle the soldering issues for this facility but a question was asked of me -- What the H@## is this stuff and what is causing it? Was wondering of I could get some input from any Guru on plating issues. Need info ASAP!!!!!!!!!!!!!!!!!!!
Industry News | 2022-03-25 08:07:42.0
Easily monitor process fluids in real time with LiquiSonic®
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
SMTnet Express, July 16, 2015, Subscribers: 23,036, Members: Companies: 14,463, Users: 38,550 Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber iNEMI (International Electronics Manufacturing Initiative) Qualification
SMTnet Express, March 17, 2022, Subscribers: 25,805, Companies: 11,547, Users: 27,113 Creep Corrosion On Lead-Free Printed Circuit Boards In High Sulfur Environments The material and process changes required to eliminate lead from
