Industry Directory | Manufacturer's Representative
Our facilities are used for navigation systems and sub assemblies (mechanical part also).
Industry Directory | Manufacturer / Other
Importer/distributor/manufacturer of connectors
CyberScan Vantage is a laser-based non-contact inspection system for scanning a target object. It combines proven laser sensor technology with computer driven X/Y translation stages. The system collects a series of Z height measurements with sub-mic
Electronics Forum | Fri Jun 26 11:27:12 EDT 1998 | Earl Moon
| | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection Han
Electronics Forum | Fri Jun 26 15:37:50 EDT 1998 | Justin Medernach
| | | Alright gentlemen and ladies of the forum, I again seek knowlage on what is probably a well known fact. I have spent a good part of the morning with various IPC standards and weighty tomes such as the Electronic Packaging and Interconnection H
Used SMT Equipment | In-Circuit Testers
The Agilent Mini-OTDR is the best selling product in Agilent's portfolio of Optical Network Test Solutions for the installation, maintenance and operation of fiber networks. The Mini-OTDR is designed to provide its users with the fastest tool avail
Used SMT Equipment | In-Circuit Testers
Advantest D3186-10-70/D3286-70 System Advantest D3186 Pulse Pattern Generator To accommodate transmission of large capacity information in the coming multimedia generation, ultra high speed digital telecommunications networks are being construct
Industry News | 2003-04-08 10:28:06.0
A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Parts & Supplies | SMT Equipment
Yamaha YG12_YS12 Shaft Head Sub Assy Head Part Number : KHY-M7107-007 Yamaha Air Valve A010E1-37W KM1-M7163-20X Yamaha Air Valve A010E1-54W KM1-M7163-21X Yamaha Air Valve A010E1-44W KM1-M7163-30X Yamaha Valve A010E1-35W KM1-M7162-20X Yamaha V
Parts & Supplies | SMT Equipment
YG12_YS12 Shaft Head Sub Assy Head Yamaha Spare parts specification: YAMAHA KGT-M917U-01X SENSOR POS OMRON E3S-LS3P YG200 YAMAHA 90K21-038011 YG12_YS12 R axis driver motor YAMAHA 90K55-4W074Z&90K50-4W074Z AC SERVO MOTOR YV100XG YAMAHA 90933
Technical Library | 2020-03-26 14:55:29.0
This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic microtopographic 3D imaging of challenging objects that are difficult or impossible to scan with traditional methods, such as machine vision or laser triangulation.Examples of well-suited applications for line confocal technology include glossy, mirror-like, transparent and multi-layered surfaces made of metals (connector pins, conductor traces, solder bumps etc.), polymers (adhesives, enclosures, coatings, etc.), ceramics (components, substrates, etc.) and glass (display panels, etc.). Line confocal sensors operate at high speed and can be used to scan fast-moving surfaces in real-time as well as stationary product samples in the laboratory. The operational principle of the line confocal method and its strengths and limitations are discussed.Three metrology applications for the technology in electronics product manufacturing are examined: 1. 3D imaging of etched PCBs for micro-etched copper surface roughness and cross-sectional profile and width of etched traces/pads. 2. Thickness, width and surface roughness measurement of conductive ink features and substrates in printed electronics applications. 3. 3D imaging of adhesive dots and lines for shape, dimensions and volume in PCB and product assembly applications.
Technical Library | 2016-08-11 15:49:59.0
The challenge for 3D IC assembly is how to manage warpage and thin wafer handling in order to achieve a high assembly yield and to ensure that the final structure can pass the specified reliability requirements. Our test vehicles have micro-bumped die having pitches ranging from 60um down to 30um. The high density of pads and the large die size, make it extremely challenging to ensure that all of the micro-bump interconnects are attached to a thin Si-interposer. In addition, the low standoff between the die and interposer make it difficult to underfill. A likely approach is to first attach the die to the interposer and then the die/interposer sub-assembly to the substrate. In this scenario, the die/interposer sub-assembly is comparable to a monolithic silicon die that can be flip chip attached to the substrate. In this paper, we will discuss various assembly options and the challenges posed by each. In this investigation, we will propose the best method to do 2.5D assembly in an OSAT(Outsourced Assembly and Test) facility.
00367071-02 Adapter cable 1 SUB-D pin - 2 SUB-D sock 03048638-02 BOX 03048639-02 MAGAZINE FOR NOZZLE P+P / S-F-D 03048676-02 MAGAZINE COMP. /2 NOZZLES P+P / S-F-D 03048803-02 reject device nozzle changer 03048851-01 CABLE:VALVE
03047845-01 Cable /s-D Placementhead 03047943S01 FCCS digital 03047976S01 Cable / splice detect TC / TC-sockets 03047984-01 Vision Board Spread Spectrum X (VBSX) 03048001-02 CPU-Bg. SMP16-CPU086 1,6GHz 256MB 03048005-01 Servo amplifier TBS200/3Z
Events Calendar | Wed Jul 19 00:00:00 EDT 2023 - Wed Jul 19 00:00:00 EDT 2023 | ,
SMTA Webinar: Secure, Intelligent, Detailed Design Data Exchange Between Design & Manufacturing
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Career Center | Brooklyn, New York USA | Production
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | Brooklyn, New York USA | Engineering,Management
Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications. With design, sales and manufacturing locations in over 30 countries, Mini-Ci
Career Center | San Diego, California USA | Production
VAN D THACH 4471 54th Street, San Diego, CA 92115 Home phone: (619) 453-3877 Email vanth11103@yahoo.com RESUME Objective Electrical and Mechanical Assembly. Education _ San Diego City C
Career Center | Villupuram, India | Production
BE in ECE, Working in one of the EMS industry (V NET TECHNOLOGY PVT LTD) in Pondicherry. Above 4 years of experience in SMT & PTH Process Cum Production line. Keyskills Process control, Planning, Manpower, 5S, Kaizan, FMEA, Six sigma, OEE
SMTnet Express, March 26, 2020, Subscribers: 35,188, Companies: 10,983, Users: 25,722 New High-Speed 3D Surface Imaging Technology in Electronics Manufacturing Applications Credits: FocalSpec, Inc. This paper introduces line confocal technology
SMT Express, Issue No. 5 - from SMTnet.com Volume 1, Issue No. 5 Wednesday, October 13, 1999 Featured Article Return to Front Page HASL WHAT A HASSLE, or HASL'd AGAINby Earl Moon INTRODUCTION This article updates one I wrote for Printed
PCB Libraries, Inc. | https://www.pcblibraries.com/POD/Default.asp?M=ADESTO&PN=AT25QF641-SUB-T
AT25QF641-SUB-T - Adesto Technologies - Free Library Parts LOGIN Downloads About Footprint Expert Parts Forum Distributors Sales
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