Industry Directory | Consultant / Service Provider / Manufacturer
Designer & Manufacturer of Acoustic Microscopes for Nondestructive Component Inspection.
Industry Directory | Manufacturer
CSM Instruments develops, manufactures and sells instruments to characterize mechanical properties of surfaces. We have been the world leader in this market for more than 30 years.
New Equipment | Test Equipment
KOH YOUNG ZENITH 2 3D AOI 8 directional projection light system Camera resolution: 8M 15μm maximum Height measurement: 10 mm Max PCB 490 x 510 mm weight: 600kg Dimension: 1000x1295x1627 mm KOH YOUNG ZENITH 2 3D AOI KOH YOUNG ZENITH 2 3D AOI R
New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
Electronics Forum | Mon Feb 08 17:11:34 EST 2010 | woodsmt
Thanks Dave and Glenn, I have setteled on Dye for the destuctive checks, and was thinking about impedence testing at intervals during ESS. Based on the research I have been doing the last several days, this seems like a method that should identify
Electronics Forum | Mon Feb 08 09:03:49 EST 2010 | woodsmt
Looking for methods for detecting BGA microcracks without cross sectioning. Currently evaluating a new package and will be putting together a thermal stress eval. We would like to perform intermediate inspections for cracks. Once all cycles are don
Used SMT Equipment | AOI / Automated Optical Inspection
Non-blind spot digital 8 projection moiré 3D inspection technology Inspection for diffuse reflection component, OCR, micro crack precisely by 8 phases coaxial color lighting Smallest componentinspection by ultra-high resolution camer
Used SMT Equipment | AOI / Automated Optical Inspection
MV-6e SeriesThe world’s best 2D AOI system The world’s best performance 2D AOI – Small component inspection up to 0201(㎜) size with high resolution 18 mega pixel CXP camera & 7.3㎛ lens– Inspection for diffuse reflection component, OCR, micro crack pr
Industry News | 2018-04-22 19:12:45.0
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2018-12-08 03:22:25.0
Electronic Components, Parts and Their Function
Parts & Supplies | Chipshooters / Chip Mounters
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700) JUKI
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Parts & Supplies | Assembly Accessories
> JUKI ESL13000000 VACUUM PAD 15 JUKI ESL13000100 PHOTO MICRO SENSOR A JUKI ESL13001000 TUBE union (KL700) JUKI ESL130011A0 CONVEYOR MOTOR (KZ500) JUKI ESL13002000 CLAMP LEVER JUKI ESL13003000 T TYPE NUT JUKI ESL130031A0 OPERATION PANEL (KL700
Technical Library | 2022-09-25 20:18:33.0
Printed circuit board (PCB) bending and/or flexing is an unavoidable phenomenon that is known to exist and is easily encountered during electronic board assembly processes. PCB bending and/or flexing is the fundamental source of tensile stress induced on the electronic components on the board assembly. For more brittle components, like ceramic-based electronic components, micro-cracks can be induced, which can eventually lead to a fatal failure of the components. For this reason, many standards organizations throughout the world specify the methods under which electronic board assemblies must be tested to ensure their robustness, sometimes as a pre-condition to more rigorous environmental tests such as thermal cycling or thermal shock.
Technical Library | 2019-05-01 23:18:27.0
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in printed circuit board manufacturing, or diffuse into the printed circuit board during storage. Moisture can reside in the resin, resin/glass interfaces, and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake compared to eutectic tin-lead reflow processes. In addition to cohesive or adhesive failures within the printed circuit board that lead to cracking and delamination, moisture can also lead to the creation of low impedance paths due to metal migration, interfacial degradation resulting in conductive filament formation, and changes in dimensional stability. Studies have shown that moisture can also reduce the glass-transition temperature and increase the dielectric constant, leading to a reduction in circuit switching speeds and an increase in propagation delay times. This paper provides an overview of printed circuit board fabrication, followed by a brief discussion of moisture diffusion processes, governing models, and dependent variables. We then present guidelines for printed circuit board handling and storage during various stages of production and fabrication so as to mitigate moisture-induced failures.
Flexible PCB Board Cutting Machine PCB Punching Machine With Cutomized Die Tooling PCB Punching Machine Features: 1. Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 2. Die toolings is changeable 3. Easy set
Separate precise SMD thin board, aluminum PCB, for special board , needs customization. If any question, just feel free to contact bella@qy-smt.com and browse Website?https://morel-equipment.com/
Career Center | Muzzaffarnagar, India | Production
Complete programming of Pick & Place as per BOM. Working with both low & high Profile solder Paste, and Glue. Accurate Placement of all SMT Component like Chip, SOT, SOD, QFP, Tantalum Capacitor & etc. Familiar with the critical problem in process
Career Center | binan city, Laguna Philippines | Engineering,Maintenance,Technical Support
6.5 Years Experience in Semiconductor Industry Specializing in Dispensing process and Equipment. 5.0 Years of Experience in Field Service Engineering. Machine Commissioning / Customer support 24 / 7, Technical Support for Customer machine and process
Hermetically Sealed SMD Tantalum Capacitors Hermetically Sealed SMD Tantalum Capacitors by: I.Zednickova, M.Biler, J.Petrzilek, T.Zednicek; AVX Corporation The article presents improvement of stability parameters of tantalum surface mounted
ASCEN Technology | https://www.ascen.ltd/Products/custom_automatic_machine/pcb_cutting_mach/358.html
. Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 2. Cast iron framework for rigidity. Punching dies are changeable
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