Industry Directory | Manufacturer
A Manufacturer of High Quality, Precision, Automated Fluid Dispensing and Conformal Coating Systems, SMT Cover Tape Peel Tester and Lead Forming machines for through-hole component preparation.
Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
The leader in component automation preparation since 1983. Surface mount, axial & radial tape and reel, programming, baking, distribution of all materials used in these processes. ISO9001-2008, WBE
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Electronics Forum | Wed Feb 15 14:03:25 EST 2006 | samir
Robert McKeown Company makes thermally conduct Al tape. KIC did a study on which method (Kapton Tape, Aluminum Tape, Hi-Temp Solder) is the most repeatable. The study can be found in their website: http://www.kicthermal.com Al Tape placed 2nd, and
Electronics Forum | Thu May 04 12:02:37 EDT 2017 | tombstonesmt
Splice in carrier tape left over or purchase leaders from suppliers like Sierra. http://tapesplice.com/product-category/flat-punched-carrier-tape/
Used SMT Equipment | Chipshooters / Chip Mounters
Yamaha SMT YSM10 Placement Machine Applicable PCB L 510 x W 460mm - L 50 x W 50mm * Consult us for board sizes exceeding dimensions L510 Mounting capability HM Head (10 Nozzle) Spec. HM5 Head (5 Nozzle) Spec. 46,000CPH (The Comp
Used SMT Equipment | Pick and Place/Feeders
Model Name: YSM10 Mounting capability: HM Head (10 Nozzle) Spec. – HM5 Head (5 Nozzle) Spec. – 46,000CPH (The Company’s optimum conditions) – 31,000CPH (The Company’s optimum conditions) Applicable components: 03015-W
Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Industry News | 2017-01-26 19:53:00.0
GPD Global will exhibit in Booth 2933 at the upcoming IPC APEX EXPO 2017 scheduled to take place February14-16, San Diego Convention Center. GPD Global will officially launch its new, fully automated dispense platform, Hyperion, and a new, low cost conformal coating system.
Parts & Supplies | Pick and Place/Feeders
GFC-Y01 YAMAHA Feeder Storage Cart The feeder storage cart gives your operators a secure place to put unused feeders between set-ups minimizing failures due to improper storage or handling. When its time to change over to the next job, the cart is
Parts & Supplies | Pick and Place/Feeders
GFC-P01 PANASERT MSR Feeder Storage Cart The feeder storage cart gives your operators a secure place to put unused feeders between set-ups minimizing failures due to improper storage or handling. When its time to change over to the next job, the
Technical Library | 2009-01-21 23:01:49.0
Over the last 10 years, the adoption of wafer-level packaging (WLP) has expanded to a wide range of semiconductor devices applied in a crosssection of industries from Automotive to Mobile Phone, Sensors to Medical Technology.
Technical Library | 2015-05-28 17:34:48.0
The printed circuit board assembly industry has long embraced the "Smaller, Lighter, Faster" mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today's 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization. This presentation will explore board and component trends, and then delve into three critical areas for successful 03015M adoption: placement equipment, assembly materials, and process controls. Beyond machine requirements, the importance of taping specifications, component shape, solder fillet, spacing gap, and stencil design are explored. We will also examine how Adaptive Process Control can increase production yields and reduce defects by placing components to solder position rather than pad. Understanding the process considerations for 03015M component mounting today will help designers and manufacturers transition to successful placement tomorrow.
Eliminate Body Stress with Versatile CF-8 GPD's CF-8 eliminates component body stress. Versatility is the key word for the CF-8. Simple tooling changes make short or long run production jobs quick and easy. Capabilities Meets exacting military s
The CF-9 Radial Lead Former forms and cuts 2- and 3-leaded taped radial components such as TO-92s, capacitors, transistors, LEDs, etc. - precisely and repeatedly, in standard and special forms. This machine is capable of forming and cutting up to 25
Career Center | Vestal, New York USA | Engineering,Research and Development
Experienced Sr./Principal Software Engineer and Systems Analyst in various applications, especially embedded real time systems and device drivers and board support including 80x86, Power PC, Motorola 68K, TI DSPs and a number of other platforms using
Career Center | , India | Maintenance
Have worked in ELECTRONICS MANUFACTURING & SEMICONDUCTOR industry for 8+ years for machine maintenance worked with TDK CORPORATION (EPCOS PTE LTD) IN SINGAPORE FOR SEMICONDUCTOR worked with NOKIA INDIA PVT LTD IN INDIA FOR SMT MACHINE MAINTENANCE
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