New SMT Equipment: temperature cycling, solder joint reliability dfr (1)

Sherlock - Automated Design Analysis software

Sherlock - Automated Design Analysis software

New Equipment | Software

Wouldn't it be nice to see into the future? With Sherlock by DfR Solutions, you can. Sherlock is a new Automated Design Analysis Tool that allows you to predict product failure earlier in the design process, allowing you to design reliability right

DfR Solutions (acquired by ANSYS Inc)

Electronics Forum: temperature cycling, solder joint reliability dfr (62)

Re: BGA rework and reliability

Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark

| Dear all, | | What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew

Re: temp stress reliability test for SMT solder bonds

Electronics Forum | Fri Apr 10 20:27:07 EDT 1998 | Jean-Paul Clech

| I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to wheth

Industry News: temperature cycling, solder joint reliability dfr (4)

Solder Joint Reliability

Industry News | 2018-10-18 08:49:15.0

Solder Joint Reliability

Flason Electronic Co.,limited

Electronics in Harsh Environments Conference Program Finalized

Industry News | 2018-02-06 20:38:21.0

SMTA Europe is excited to announce the finalized program for Electronics in Harsh Environments Conference. The event will be held April 24-26, 2018 at the Crowne Plaza Amsterdam – Schiphol in Amsterdam, Netherlands.

Surface Mount Technology Association (SMTA)

Technical Library: temperature cycling, solder joint reliability dfr (1)

Solder Phase Coarsening, Fundamentals, Preparation, Measurement and Prediction

Technical Library | 2009-05-07 23:23:00.0

Thermal fatigue has been one of the most serious problems for solder joint reliability. Thermo-mechanical fatigue failure is considered to be closely related to micro-structural coarsening (grain/phase growth). Factors that influence the phase growth are studied and measurement methods are discussed, including the preparation of the eutectic solder sample for phase size measurement. Three categories of models used to predict grain growth in polycrystalline materials are presented. Finally, phase growth in solder during high temperature aging and temperature cycling and its use as a damage correlation factor are discussed.

DfR Solutions (acquired by ANSYS Inc)

Videos: temperature cycling, solder joint reliability dfr (3)

PCB solder paste printer, solder paste printer , auto stencil printer ,pcb screen printer , Solder Paste Screen Printer

PCB solder paste printer, solder paste printer , auto stencil printer ,pcb screen printer , Solder Paste Screen Printer

Videos

https://www.ascen.ltd/Products/Solder_paste_printer/513.html full auto PCB screen printer and SMT solder paste printing machine with Image and optical system,It is a very accurate fully automatic SMT stencil printer.automatic PCB screen printer main

ASCEN Technology

HeatShieldGel(TM)

HeatShieldGel(TM)

Videos

To order, visit http://www.solder.net/products/heatshieldgel-tm/ BEST HeatShield Gel™ is a thermal shield water-based gel designed to be used in the PCB rework/repair or board assembly areas in order to provide thermal protection of electronic compo

BEST Inc.

Events Calendar: temperature cycling, solder joint reliability dfr (1)

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Surface Mount Technology Association (SMTA)

Career Center - Jobs: temperature cycling, solder joint reliability dfr (2)

SMT Supervisor

Career Center | Van Nuys, California USA | Production

We are an ISO 9000, AS 9100, ISO 13485 and NASA certified;  Quick Turn, High Reliability, Contract Manufacturer of PCB assemblies, located in the San Fernando Valley. We serve the aerospace, military, space, medical and telecommunications and other L

Electronic Source Company

SMT Supervisor

Career Center | Williamsport, Pennsylvania USA | Engineering,Management

PRIMUS Technologies Corporation is an electronic manufacturing services (EMS) provider that produces highly reliable products for global government and commercial markets. Our company is an integrated lean enterprise that fully embodies the Six Sigma

PRIMUS Technologies Corp

Express Newsletter: temperature cycling, solder joint reliability dfr (729)

SMTnet Express - January 2, 2020

SMTnet Express, January 2, 2020, Subscribers: 33,306, Companies: 10,954, Users: 25,467 Temperature Cycling and Fatigue in Electronics Credits: DfR Solutions The majority of electronic failures occur due to thermally induced stresses and strains

SMTnet Express - February 6, 2020

SMTnet Express, February 6, 2020, Subscribers: 33,800, Companies: 10,971, Users: 25,576 Accurately Capturing System-Level Failure of Solder Joints Credits: DfR Solutions Consortium Projects - Thermal Cycling Reliability Consortium projects allow

Partner Websites: temperature cycling, solder joint reliability dfr (153)

The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability

Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf

. Recommendations are made for further work based on other void reduction methods and additional reliability studies. Key words: Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys

Heller 公司

High Reliability Alloy Solder Paste For ENIG - PCBASupplies

| https://pcbasupplies.com/alloy-solder-paste-enig/

. High Reliability Alloy Solder Paste SAC305 For better joint reliability In comparison with SAC305, SB6NX has better elongation property and is less prone to deformation


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